Abstract:We introduce a Ag-Ag direct bonding process with the aid of ultrasonic bonding, which uses silver “Nano-volcanic eruption of Ag” caused by stress migration at 250 °C. Various preheating temperatures before the ultrasonic pulse and various sputtering methods such as direct current (DC) and radio frequency (RF) have also been evaluated. A novel bonding process which combines ultrasonic bonding and stress migration bonding (SMB) method is established. The bonding achieved a die-shear strength of more than 50 MPa … Show more
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