Thermally Induced Fracture of a Piezoelectric Laminate With a Crack Normal to Interfaces

Ueda, Sei

doi:10.1080/713855899

Cited by 55 publications

(23 citation statements)

References 15 publications

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“…Some solutions of static piezothermoelectic media with cracks have been given [7][8][9][10]. Recently, the present author also studied the thermally induced fracture of a piezoelectric strip with a parallel crack [11].…”

Section: Introductionmentioning

confidence: 93%

Transient Response of a Cracked Piezoelectric Strip Under Thermoelectric Loading

Ueda

2006

Journal of Thermal Stresses

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In this study, the theoretical analysis of a transient piezothermoelastic problem is developed for a piezoelectric strip with a parallel crack under static electric loading and thermal shock loading conditions. The crack faces are supposed to be insulated thermally and electrically. By using both the Laplace transform and the Fourier transform, the thermal and electromechanical problems are reduced to a system of singular integral equations, respectively, which are solved numerically. Some numerical results for the temperature change, the stress and electric displacement distributions, and the energy density factor as well as the stress and electric displacement intensity factors in a transient state are shown in figures.

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Section: Introductionmentioning

confidence: 93%

Transient Response of a Cracked Piezoelectric Strip Under Thermoelectric Loading

Ueda

2006

Journal of Thermal Stresses

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“…A review on the fracture analysis of thermo-piezoelectric materials was reported by Qin (2001). More recent research into the fracture mechanics of thermo-piezoelectric materials focuses on more complicated problems, for example, complex crack geometries in the form of multiple cracks (Ueda, 2003;Ueda, 2006;Ueda and Ishii, 2008;Ueda and Hatano, 2012;Zhang and Wang, 2013), functionally graded piezoelectric materials (Ueda, 2007) and elasto-dynamics (Ueda, 2008). These analytical solutions of the thermally induced fracture are mostly derived for standard crack configurations in infinite domains subjected to simple loading conditions.…”

Section: Introductionmentioning

confidence: 98%

SBFEM for fracture analysis of piezoelectric composites under thermal load

Ooi

Song

et al. 2015

International Journal of Solids and Structures

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a b s t r a c tThis paper extends a semi-analytical technique, the so-called scaled boundary finite element method (SBFEM), to analyze fracture behaviors of piezoelectric materials and piezoelectric composites under thermal loading. In this method, only the boundary is discretized leading to a reduction of the spatial dimension by one. The temperature field in the domain is obtained using the SBFEM and expressed as a series of power functions of the radial coordinate. The resulting stress and electric displacement distribution along the radial direction is represented analytically. This permits the generalized stress and electric displacement intensity factors to be directly evaluated from the solution by following standard stress recovery procedures in the finite element method (FEM). Numerical examples are presented to verify the proposed technique with the analytical solutions and the results from the literature. The present results highlight the accuracy, simplicity and efficiency of the proposed technique.

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“…The transient dynamic fracture mechanics of FGPM in [7] deals with unbounded media, and in [8] treats the FGPM strip. Although much attention has been focused on the thermoelectromechanical fracture analysis of homogeneous piezoelectric materials [9][10][11][12][13], less attention has been paid to the study of the corresponding problem for FGPMs. Wang and Noda [14] 126 S. UEDA investigated the thermally induced fracture of a smart functionally graded composite structure, and the present author also studied the fracture of a functionally graded piezoelectric strip due to the thermal load [15].…”

Section: Introductionmentioning

confidence: 99%

Thermoelectromechanical Response of a Center Crack in a Symmetrical Functionally Graded Piezoelectric Strip

Ueda

2007

Journal of Thermal Stresses

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The thermoelectromechanical fracture problem for a symmetrical functionally graded piezoelectric strip containing a center crack parallel to the free boundaries is considered in this study. It is assumed that the thermoelectroelastic properties of the medium vary continuously in the thickness direction, and that the strip is under thermomechanical loadings. The crack faces are supposed to be insulated thermally and electrically. By using the Fourier transform, the thermal and electromechanical problems are reduced to singular integral equations, respectively, which are solved numerically. Numerical calculations are carried out, and detailed results are presented to illustrate the influence of the crack length and the material nonhomogeneity on the temperaturestress distributions and the stress intensity factor.

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Thermally Induced Fracture of a Piezoelectric Laminate With a Crack Normal to Interfaces

Cited by 55 publications

References 15 publications

Transient Response of a Cracked Piezoelectric Strip Under Thermoelectric Loading

Transient Response of a Cracked Piezoelectric Strip Under Thermoelectric Loading

SBFEM for fracture analysis of piezoelectric composites under thermal load

Thermoelectromechanical Response of a Center Crack in a Symmetrical Functionally Graded Piezoelectric Strip

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