2009
DOI: 10.1016/j.physb.2009.09.036
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Thermally induced defects in a polycrystalline diamond layer on a tungsten carbide substrate

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Cited by 10 publications
(7 citation statements)
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“…This results in the presence of tungsten and carbon in solid solution with cobalt. Tungsten atoms will fit substitutionally in the cobalt (2)(3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15) wt.% at 1250°C) and carbon atoms will fit interstitially in the cobalt (0-0.2 wt.% at elevated temperatures). The solid solution elements are expected to increase the lattice parameter of the cobalt [26].…”
Section: Thermal Soaking In Argonmentioning
confidence: 99%
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“…This results in the presence of tungsten and carbon in solid solution with cobalt. Tungsten atoms will fit substitutionally in the cobalt (2)(3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15) wt.% at 1250°C) and carbon atoms will fit interstitially in the cobalt (0-0.2 wt.% at elevated temperatures). The solid solution elements are expected to increase the lattice parameter of the cobalt [26].…”
Section: Thermal Soaking In Argonmentioning
confidence: 99%
“…Pin-on-disc experiments performed at high temperatures showed that cracking of the PCD microstructure only occurred at temperatures above 700°C, where graphitisation of the material could be a contributing factor [9]. To a lesser degree, other factors considered in the study of thermal degradation of PCD are oxidation of the diamond [13], oxidation of the cobalt [14,15], the macro-residual stress state between the diamond layer and the tungsten carbide backing [16], and chemical reactions between the rock/cooling fluids used during operations [17].…”
Section: Introductionmentioning
confidence: 99%
“…After annealing at 500°C in ambient air, the oxidization reaction of W and Co has occurred with the change of the color of WC-Co substrate (Fig. 5b), which has been mentioned in previous reference [17]. However, Fig.…”
Section: Morphologiesmentioning
confidence: 59%
“…2c. The previous references [8,17] have indicated that W, with very low quantity, comes from thermal diffusion and infiltration during sintering process.…”
Section: Methodsmentioning
confidence: 99%
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