Thermally enhanced SMT power components

This manuscript investigates thermal performance of x-dimension (x-dim) passive components, during operation and soldering by means of 3D FEM thermal simulations and experiments. X-dim components feature standardized height, double-sided SMT terminations, and improved thermal behaviour and can be stacked between PCBs to achieve 3D spatial layout. During components operation, standard passives with different shapes are suitable for convection-while x-dim components with standardized geometry, for conduction heat transfer from their surfaces. Conduction heat transfer is found to be more effective than convection, especially for passives inside a sealed enclosure. Further, the paper shows how x-dim components can be utilized for the heat conduction from other passives in a stacked assembly. With respect to reflow soldering of passives, phase-change-is clearly identified as superior over convection-heat transfer. Phase-change soldering is, through number of thermal simulations and experiments, proven to be effective for soldering of power passive x-dim components.

show abstract

“…In x dimension passive components the heat conduction can be enhanced by filling the air pockets inside component by thermal glue (Fig. 4) [12].…”

Section: Thermal Management Levels and Methods In Industrial Drivesmentioning

confidence: 99%

“…Construction of bare metal-film capacitor [12] enclosed with heat resistant encapsulation is shown in Fig. 2b.…”

Section: B X-dimension Metal-film Capacitors With Heat Resistant Encmentioning

confidence: 99%

Thermal performance of double-sided SMT capacitors: Operation and soldering

Josifovic

Huesgen

Popović

et al. 2013

2013 IEEE ECCE Asia Downunder

Self Cite

View full text Add to dashboard Cite

show abstract

“…Further, x-dim components are active in the heat removal generated by components placed in adjacent stack layers providing heat conduction paths [7] as illustrated in Fig. 2b.…”

Section: A the Power Sandwich -Concept Overviewmentioning

confidence: 99%

“…SMT X-dim Components X-dimension components proposed in [7] are SMT passive components that have double-sided electrical terminations, optimized geometry (i.e. compatible profiles), reduced packaging and enhanced thermal properties.…”

Section: A the Power Sandwich -Concept Overviewmentioning

confidence: 99%

See 1 more Smart Citation

Power Sandwich: An integration technology for manufacturability

Ferreira

Popović

Josifovic

2010

The 2010 International Power Electronics Conference - ECCE ASIA -

Self Cite

View full text Add to dashboard Cite

This paper presents a novel power electronics construction technology for surface mount technology (SMT) automated manufacturing of power convertersPower Sandwich. The Power Sandwich manufacturing method employs new x-dimension components, having the same height (x) and double sided SMT electrical terminations. The components are stacked between planar substrates and can be soldered on both, top and bottom sides using the multilayer Power Sandwich assembly process. The process is compatible with standard SMT assembly line with some alternations. By arranging the components in different stack layers an increase in power density and better heat removal from the systems can be achieved. Power Sandwich is an enabling integration technology for achieving both SMT automated construction and high power densities of power electronics converters.

show abstract