Thermally Coupled NTC Disk Thermistors for Power Applications

Bodic, Milan Z.; Rajs, Vladimir M.; Aleksic, Stanko O.; Damnjanović, Mirjana S.; Kisić, Milica G.

doi:10.1109/jsen.2024.3371181

Cited by 1 publication

(3 citation statements)

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“…The properties of the TCCT device were compared in Table 1 with the thick film (TF) TCT device and disk TCDT properties which were published recently in [ 30 , 31 ].…”

Section: Discussionmentioning

confidence: 99%

“…The properties of the TCCT device were compared in Table 1 with the thick film (TF) TCT device and disk TCDT properties which were published recently in [30,31]. The TCCT is a cubic device and has around 30 times lower volume compared to the TCDT device and around 100 times compared to the thick film TF TCT.…”

Section: Comparison Of Tcct With Tf Tct and Tcdt Devicesmentioning

confidence: 99%

“…The output thermistor can be connected to an operational amplifier and used in different ways: feedback to input power, output temperature to input power convertor, electro-thermal potentiometers, etc. In comparison to the thick film (TF) TCT device with segmented thermistors and disk TCDT device which were realized recently in our previous work [30,31], the TCCT device has the following advantages: it occupies the smallest surface and has a simpler construction, lower cost, smaller power, and a high availability of chip thermistors with different nominal resistances, which is suitable for the realization of different resistance ratios in a thermal coupling device. A novel chip TCCT device is based on NTC chip thermistors.…”

Section: Introductionmentioning

confidence: 99%

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Thermally Coupled NTC Chip Thermistors: Their Properties and Applications

Bodić,

Aleksić,

Rajs

et al. 2024

Sensors

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Negative temperature coefficient (NTC) chip thermistors were thermally coupled to form a novel device (TCCT) aimed for application in microelectronics. It consists of two NTC chip thermistors Th1 and Th2, which are small in size (0603) and power (1/10 W). They are in thermal junction, but concurrently they are electrically isolated. The first thermistor Th1 generates heat as a self-heating component at a constant supply voltage U (input thermistor), while the second thermistor Th2 receives heat as a passive component (output thermistor). The temperature dependence R(T) of NTC chip thermistors was measured in the climatic test chamber, and the exponential factor B10/30 of thermistor resistance was determined. After that, a self–heating current I1 of the input thermistor was measured vs. supply voltage U and ambient temperature Ta as a parameter. Input resistance R1 was determined as a ratio of U and I1 while output thermistor resistance R2 was measured by a multimeter concurrently with the current I1. Temperatures T1 and T2 of both thermistors were determined using the Steinhart–Hart equation. Heat transfer, thermal response, stability, and inaccuracy were analyzed. The application of thermally coupled NTC chip thermistors is expected in microelectronics for the input to output electrical decoupling/thermal coupling of slow changeable signals.

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“…The properties of the TCCT device were compared in Table 1 with the thick film (TF) TCT device and disk TCDT properties which were published recently in [ 30 , 31 ].…”

Section: Discussionmentioning

confidence: 99%

Section: Comparison Of Tcct With Tf Tct and Tcdt Devicesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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