2021
DOI: 10.1038/s41563-021-00934-3
|View full text |Cite
|
Sign up to set email alerts
|

Thermally conductive ultra-low-k dielectric layers based on two-dimensional covalent organic frameworks

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

7
164
0
1

Year Published

2021
2021
2024
2024

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 183 publications
(172 citation statements)
references
References 39 publications
7
164
0
1
Order By: Relevance
“…Considering the influence of the microstructure on the overall thermal conductivity of composites, a specially designed heat conduction path is constructed during the processing to reduce transmission resistance of phonons to obtain high thermal conductivity in a certain direction [ 46 , 47 , 48 , 49 ]. As shown in Figure 8 , Xu et al [ 50 ] constructed a 3D BN foam to achieve good thermal conductivity and insulation simultaneously.…”
Section: Modification Of Thermal Characteristics Of Epoxy Resin Composite Foam Insulation Materialsmentioning
confidence: 99%
See 2 more Smart Citations
“…Considering the influence of the microstructure on the overall thermal conductivity of composites, a specially designed heat conduction path is constructed during the processing to reduce transmission resistance of phonons to obtain high thermal conductivity in a certain direction [ 46 , 47 , 48 , 49 ]. As shown in Figure 8 , Xu et al [ 50 ] constructed a 3D BN foam to achieve good thermal conductivity and insulation simultaneously.…”
Section: Modification Of Thermal Characteristics Of Epoxy Resin Composite Foam Insulation Materialsmentioning
confidence: 99%
“…However, in practical applications, this type of filler is expensive and generally added only in a small amount, that is, it is added as an auxiliary filler together with other fillers to improve the thermal conductivity and insulation performance of composites. Considering the influence of the microstructure on the overall thermal conductivity of composites, a specially designed heat conduction path is constructed during the processing to reduce transmission resistance of phonons to obtain high thermal conductivity in a certain direction [46][47][48][49]. As shown in Figure 8, Xu et al [50] constructed a 3D BN foam to achieve good thermal conductivity and insulation simultaneously.…”
Section: Filling Modification Of Thermally Conductive Particlesmentioning
confidence: 99%
See 1 more Smart Citation
“…Covalent organic frameworks (COFs) have emerged as a new class of 2D crystalline porous materials with unique designability with respect to topology diagram, pore environments, chemical structure and functionalities. COFs have been investigated into multifarious applications of gas adsorption and separation, [29–32] energy storage, [33–36] chemical sensors, [37–39] proton or ion conduction, [40–43] catalysis, [44–48] and some promising semiconductor devices [49–52] . Unfortunately, the research on nonvolatile resistive switching memory devices based on 2D COFs is still in its infancy.…”
Section: Introductionmentioning
confidence: 99%
“…Covalent organic frameworks (COFs) have emerged as an ew class of 2D crystalline porous materials with unique designability with respect to topology diagram, pore environments,c hemical structure and functionalities.C OFs have been investigated into multifarious applications of gas adsorption and separation, [29][30][31][32] energy storage, [33][34][35][36] chemical sensors, [37][38][39] proton or ion conduction, [40][41][42][43] catalysis, [44][45][46][47][48] and some promising semiconductor devices. [49][50][51][52] Unfortunately, the research on nonvolatile resistive switching memory devices based on 2D COFs is still in its infancy. There are several main reasons we speculated as the following: 1) Above all, it remains ag reat challenge to shape nanocrystalline COFs into thin films with large scale and tunable electronic properties owing to their insolubility and nonprocessability;2 )COF thin-film synthetic methodologies for memory devices are imperfect in terms of scale,t hickness, roughness,l ayer orientation, and crystallinity;3 )more strikingly,t he relationship of memristor performance to the chemical structure of COFs is not yet clear.…”
Section: Introductionmentioning
confidence: 99%