2022
DOI: 10.1007/s10118-022-2673-9
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Thermally Conductive Poly(lactic acid) Composites with Superior Electromagnetic Shielding Performances via 3D Printing Technology

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Cited by 176 publications
(62 citation statements)
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“…The rapid development of modern electronic technology has put forward newer and higher requirements for polymer-based EMI shielding composites. In addition to ensuring its excellent EMI shielding performance, it also needs to have good flexibility, thermal conductivity, self-heating performance and mechanical properties [ 34 , 35 ]. By introducing multifunctional fillers and constructing the layered structure, it is feasible to realize the multifunctional compatibility design of polymer-based EMI shielding composites [ 36 , 37 ].…”
Section: Possible Directions For Developing Polymer-based Emi Shieldi...mentioning
confidence: 99%
“…The rapid development of modern electronic technology has put forward newer and higher requirements for polymer-based EMI shielding composites. In addition to ensuring its excellent EMI shielding performance, it also needs to have good flexibility, thermal conductivity, self-heating performance and mechanical properties [ 34 , 35 ]. By introducing multifunctional fillers and constructing the layered structure, it is feasible to realize the multifunctional compatibility design of polymer-based EMI shielding composites [ 36 , 37 ].…”
Section: Possible Directions For Developing Polymer-based Emi Shieldi...mentioning
confidence: 99%
“…The construction of efficient three-dimensional (3D) conductive networks can effectively reduce the percolation threshold of rGO/polymer composites, so as to realize the synergistic improvement of σ , EMI shielding performances and mechanical properties for polymer composites at low filler content [ 20 , 21 ]. Current methods for constructing efficient 3D conductive networks in polymer-based composites mainly include foaming, surface coating-hot pressing and sol–gel methods, etc .…”
Section: Introductionmentioning
confidence: 99%
“…The calculated heat‐resistance index ( T HRI ) was calculated according to the data in Figure 3 and Table 2. [ 40,41 ] The T HRI of 170BF‐B plywood decreased by 22.37 °C compared with that of untreated plywood. The results exhibited that after flame retardant treatment, the wood materials quickly formed carbon under the condition of nitrogen before 300 °C, forming a stable flame retardant layer, which played a role in inhibiting the combustion spread of wood materials.…”
Section: Resultsmentioning
confidence: 99%
“…The calculated heat-resistance index (T HRI ) was calculated according to the data in Figure 3 and Table 2. [40,41] The T HRI of 170BF-B plywood decreased by 22.37 °C compared with that of untreated plywood.…”
Section: Thermal Stability Analysis Of Bio-based In Situ Polymerizati...mentioning
confidence: 96%