Thermally Conductive Elastomer Composites with Poly(catechol-polyamine)-Modified Boron Nitride

Abstract

Effective heat dissipation has become a major concern with the rapid development of microelectronic devices. In general, thermally conductive fillers are incorporated into the polymeric matrix to increase the thermal conductivity of polymer composites. Herein, poly­(catechol-polyamine) (PCPA) is employed to modify boron nitride (BN) platelets, referred to as BN-PCPA, and improves the interfacial compatibility between a thermally conductive filler and elastomer matrix, resulting in carboxylated acrylonitrile-butadiene rubber (XNBR) composites filled with BN-PCPA platelets with enhanced thermal conductivity. The influence of PCPA thickness on the mechanical properties, thermal conductivity, and dielectric properties of BN-PCPA/XNBR composites is systematically studied. Briefly, the interfacial compatibility between the BN-PCPA filler and XNBR matrix increases with increasing PCPA thickness, leading to enhanced thermal conductivity. The maximum thermal conductivity of 0.399 W/(m·K) has been rendered by the BN-PCPA-12h/XNBR composite, which is about 2.5 times of pure XNBR. This work provides an easy route to develop polymer composites with a relatively high thermal conductivity and high dielectric constant for potential application in practical electronic packaging.

Improved Thermal Conductivity of Polymer Composites by Noncovalent Modification of Boron Nitride via Tannic Acid Chemistry

“…As shown in Figure d, the tensile strengths of 30 vol % BN-TA-XNBR and 30 vol % BN-XNBR composites are 17.35 and 11.24 MPa, respectively, while that for pure XNBR is 2.58 MPa. The higher tensile strength of BN-TA-XNBR composites is due to the role of TA . On one hand, TA enhances the interfacial interaction and compatibility between the BN platelets and XNBR matrix, resulting in efficient stress transfer to avoid the deformation of XNBR composites .…”

“…The higher tensile strength of BN-TA-XNBR composites is due to the role of TA. 39 On one hand, TA enhances the interfacial interaction and compatibility between the BN platelets and XNBR matrix, resulting in efficient stress transfer to avoid the deformation of XNBR composites. 40 On the other hand, TA improves the dispersion of fillers in the XNBR matrix, which is advantageous for imparting strength to the interface by promoting stress transfer from the XNBR matrix to BN-TA platelets.…”

Evaluation of thermal conductivity and esthetic quality of denture base resin composites with acrylic polymer and nanodiamonds

“…The actual temperature and heat flux under controlled temperature conditions were monitored using a heat flow data logger (HIOKI LR8432) until they reached their steady states. The thermal conductivity, k , (in W m −1 K −1 ) of the samples was calculated using Fourier's law, given by Equation () 31 : where q is the heat flux (in kJ/m 2 ), ∆T is the temperature difference between two surfaces (in K), and x is the sample thickness (in m). In the present case, ∆T represents the difference in the measured temperatures between the hot and cold surfaces (− ∆T = T 1 – T 2 ).…”

“…The actual temperature and heat flux under controlled temperature conditions were monitored using a heat flow data logger (HIOKI LR8432) until they reached their steady states. The thermal conductivity, k, (in W m À1 K À1 ) of the samples was calculated using Fourier's law, given by Equation (1) 31 :…”

Polymer-Assisted Dispersion of Boron Nitride/Graphene in a Thermoplastic Polyurethane Hybrid for Cooled Smart Clothes

“…In addition, the dispersion of the nanofillers in composite materials also affects the thermal conductivity because heat transfer usually occurs via the vibrational energy of atoms in solid materials. Ordered and closely packed nanofillers afford fewer interfaces, which implies a reduction in phonon scattering . Therefore, a fine dispersion of fillers can increase the thermal conductivity of polymer composite materials.…”