2023
DOI: 10.1016/j.compositesa.2023.107533
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Thermally conductive composites based on hexagonal boron nitride nanosheets for thermal management: Fundamentals to applications

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Cited by 45 publications
(13 citation statements)
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“…Until now, the primary approach to enhancing the stability of sensors has involved encapsulating the sensing layer with packaging materials such as poly­(dimethylsiloxane) and Ecoflex. Despite significant advancements, the enhancement in comprehensive properties, including mechanical stretchability and sensing performance, remains suboptimal due to the mismatched Young’s modulus between the flexible substrate and encapsulation layer. , Additionally, most of the above-mentioned polymer packaging materials suffer from a low intrinsic thermal conductivity, making it difficult to meet the high thermal dissipation demands of flexible electronics. Over the past decade, substantial effort has been devoted to enhancing the thermal conductivity of polymers by incorporating highly thermally conductive and electric insulating fillers. Among these fillers, boron nitride nanosheets (BNNSs) with wide band gap (∼5.9 eV), high aspect ratio, and distinguished theoretical thermal conductivity have emerged as leading candidates for fabricating thermally dissipative composites. Particularly, the high orientation and strong van der Waals interactions between the polymer and BNNS are beneficial to constructing effective thermally conductive pathways and reducing phonon scattering among the interacting units, hence greatly enhancing the thermal conductivity at low filler percolation thresholds. In this regard, the strategic design of both electrical and thermal conduction channels based on electrospinning polymer/MXene films and polymer/BNNS composites is expected to enhance the sensing performance and realize rapid heat dissipation in flexible strain sensors.…”
Section: Introductionmentioning
confidence: 99%
“…Until now, the primary approach to enhancing the stability of sensors has involved encapsulating the sensing layer with packaging materials such as poly­(dimethylsiloxane) and Ecoflex. Despite significant advancements, the enhancement in comprehensive properties, including mechanical stretchability and sensing performance, remains suboptimal due to the mismatched Young’s modulus between the flexible substrate and encapsulation layer. , Additionally, most of the above-mentioned polymer packaging materials suffer from a low intrinsic thermal conductivity, making it difficult to meet the high thermal dissipation demands of flexible electronics. Over the past decade, substantial effort has been devoted to enhancing the thermal conductivity of polymers by incorporating highly thermally conductive and electric insulating fillers. Among these fillers, boron nitride nanosheets (BNNSs) with wide band gap (∼5.9 eV), high aspect ratio, and distinguished theoretical thermal conductivity have emerged as leading candidates for fabricating thermally dissipative composites. Particularly, the high orientation and strong van der Waals interactions between the polymer and BNNS are beneficial to constructing effective thermally conductive pathways and reducing phonon scattering among the interacting units, hence greatly enhancing the thermal conductivity at low filler percolation thresholds. In this regard, the strategic design of both electrical and thermal conduction channels based on electrospinning polymer/MXene films and polymer/BNNS composites is expected to enhance the sensing performance and realize rapid heat dissipation in flexible strain sensors.…”
Section: Introductionmentioning
confidence: 99%
“…However, the traditional approach of maximizing filler content and mixing them randomly in polymers presents limitations in enhancing TC efficiency. More seriously, this method significantly compromises both the mechanical performance and economic viability. …”
Section: Introductionmentioning
confidence: 99%
“…Termed “white graphene”, boron nitride nanosheets (BNNSs) are 2D materials obtained through the exfoliation of hexagonal boron nitride (h-BN). These nanosheets share thermal and mechanical strength traits akin to graphene but stand out due to their distinctive properties of electrical insulation (band gap ∼6 eV) and chemical inertness. Particularly, the thermal conductivity of ultrathin BNNS can reach up to 400–2000 W/m K. The versatility and exceptional thermal properties of BNNS position them as highly suitable candidates for incorporation as thermal conductivity fillers in polymeric composites. However, achieving large-scale production of high-quality BNNS and maintaining their stable dispersion in various matrices, especially in polymeric composites, are identified as key challenges. BNNS can be synthesized using various methods, including the wet chemical method, ball milling, and liquid-phase exfoliation. Among these techniques, the liquid-phase exfoliation (LPE) method stands out as a favorable approach for BNNS production due to its simplicity, cost-effectiveness, and high efficiency.…”
Section: Introductionmentioning
confidence: 99%