Proceedings of Japan International Electronic Manufacturing Technology Symposium
DOI: 10.1109/iemt.1993.639352
|View full text |Cite
|
Sign up to set email alerts
|

Thermally Conductive Circuit Board Using Anodized Aluminum And Polymer Thick Film

Abstract: This paper describes newly developed thermally conductive circuit board. The board consists of an anodized aluminum substrate, which is coated with electrodeposited acrylic-melamine polymer.Both anodized aluminum and electrodeposited polymer work as insulating layers between aluminum core and electrical circuitry. Polymer thick film (PTF) is adopted as circuitization in the board. This paper describes manufacturing process and evaluation results of the board from the viewpoint of both electrical and thermal re… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 1 publication
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?