Abstract:This work synthesizes three kinds of polyurethane elastomers to verify the relationship between macroscopic and viscoelastic properties with the given branched factor of work.
“…4h presents statistical data representing the relationship between the thermal conductivity and elastic modulus of silicone, foams, ceramics, and various polymeric composites enhanced with fillers such as LM, carbon nanotubes, and graphene, among others. 15,19,27,34,37,45,50,[59][60][61][62][63] The composite material thus developed, featuring low modulus, high deformability, and high k, demonstrates pressure-controlled heat dissipation capabilities and dynamic thermal dissipation in complex environments. This surpasses the heat dissipation performance of commercial TIMs, highlighting its potential as a high-performance TIMs for flexible electronics.…”
Section: Resultsmentioning
confidence: 99%
“…19,25,26 By controlling these aspects, it becomes possible to lower the modulus of polymer-based TIMs, which is beneficial for reducing contact thermal resistance. In this regard, Shi et al 27 reported thermally conductive and compliant polyurethane elastomer/Al composites by constructing a tri-branched polymer network, exhibiting a thermal conductivity (k) of around 1.8 W m À1 K À1 , a low Young's modulus of 640 kPa, and a low thermal contact resistance (R c ) of 0.11 K cm 2 W À1 . Besides, trapped entanglements imposed a preordained lower limit on the elastic modulus, with G 4 G e D rRT/M e , where G e represents the modulus due to entanglements, and M e is the number-average molar mass of the entanglement strand.…”
A series of patterned LM pathways are embedded in brush-shaped polymers, by combining vertically oriented graphene aerogels (VGAs) to fabricate soft elasticity thermally conductive composites for dynamic thermal management.
“…4h presents statistical data representing the relationship between the thermal conductivity and elastic modulus of silicone, foams, ceramics, and various polymeric composites enhanced with fillers such as LM, carbon nanotubes, and graphene, among others. 15,19,27,34,37,45,50,[59][60][61][62][63] The composite material thus developed, featuring low modulus, high deformability, and high k, demonstrates pressure-controlled heat dissipation capabilities and dynamic thermal dissipation in complex environments. This surpasses the heat dissipation performance of commercial TIMs, highlighting its potential as a high-performance TIMs for flexible electronics.…”
Section: Resultsmentioning
confidence: 99%
“…19,25,26 By controlling these aspects, it becomes possible to lower the modulus of polymer-based TIMs, which is beneficial for reducing contact thermal resistance. In this regard, Shi et al 27 reported thermally conductive and compliant polyurethane elastomer/Al composites by constructing a tri-branched polymer network, exhibiting a thermal conductivity (k) of around 1.8 W m À1 K À1 , a low Young's modulus of 640 kPa, and a low thermal contact resistance (R c ) of 0.11 K cm 2 W À1 . Besides, trapped entanglements imposed a preordained lower limit on the elastic modulus, with G 4 G e D rRT/M e , where G e represents the modulus due to entanglements, and M e is the number-average molar mass of the entanglement strand.…”
A series of patterned LM pathways are embedded in brush-shaped polymers, by combining vertically oriented graphene aerogels (VGAs) to fabricate soft elasticity thermally conductive composites for dynamic thermal management.
“…The uninterrupted 3D structure can provide minimal interfacial thermal resistance, guaranteeing that the majority of the heat is conducted through the filler network, which enhances the thermal conductivity of composite materials that are based on polymers. [29][30][31][32][33] Li et al successfully generated a pioneering 3D network of SiC skeleton with a SiO 2 core-shell structure. 34 Compared to traditional composite materials, composite materials based on 3D filling networks exhibit significantly improved thermal conductivity.…”
High thermally conductive polymer composites have garnered significant attention due to their exceptional performance, given the ever‐decreasing size of electronic devices and the rise in power densities. Herein, a new three‐dimensional (3D) thermal conductivity network structure has been successfully prepared using double fillers of nickel foam (NF) and modified silicon carbide particles (KSiC). The study compared the effect of different filler contents on the thermal conductivity of composites. Compared to conventional composites, those based on 3D filling networks have significantly improved thermal conductivity. The thermal conductivity of the NF/KSiC/PU composite containing 50 wt% KSiC was 1.18 Wm−1 K−1, exceeding the cumulative thermal conductivity of the NF/PU and KSiC/PU 50 wt% composites, and 637.5% greater than that of neat PU. Meanwhile, the synthesized NF/KSiC/PU composite maintained a high electrical resistivity above 1012 Ω·cm and good mechanical properties. This approach might offer novel solutions for developing high‐quality packaging materials for advanced electronic devices with exceptional thermal and mechanical properties.Highlights
Using SiC and NF Constructs a dual filler network.
The dual filler thermal conductivity network can generate synergistic effects.
Improving thermal conductivity compared to original polyurethane.
Maintaining a high electrical resistivity and good mechanical properties.
“…Wen et al [ 38 ] synthesized polyurethane resins with functional side chains, which allow for specific functional modifications of the polyurethane. Shi et al [ 39 ] prepared a series of polyurethanes with tunable properties by grafting common inexpensive side chains. Nonetheless, few people have optimized the mechanical properties of polyurethane by side chains and further used them in 3D printing to fabricate stretchable sensors.…”
The poor mechanical properties and difficulties in manufacturing complex structures seriously limit the applications of elastomers especially in flexible electronic sensor. Herein, a series of polyether amine (PEA) grafted polyurethane acrylate oligomers (PUA‐g‐PEAs) and the corresponding low‐viscosity UV‐curable flexible 3D printing elastomers (PEA‐1/IDAs) were synthesized. The results showed that a certain amount of PEA branch exactly had strengthening and toughening effect on polyurethane, resulting in 12% increase in tensile strength and 44% increase in elongation at break of PUA‐g‐PEA‐1. When mixed PUA‐g‐PEA‐1with ACMO and IDA in the ratio of 3:5:2, PEA‐1/IDA‐20 with best overall mechanical properties was obtained. Its tensile strength and elongation at break were 18.5 MPa and 297.4%, respectively. The unprecedented fatigue resistance of PEA‐1/IDA‐20 ensured that it can withstand 100 compression cycles at 80% strain without damage. Besides, piezoresistive sensors and wearable finger guard sensors were fabricated by laminating a layer of conductive hydrogel on the surface of the 3D‐printed devices. The impressive mechanical properties and 3D printing producing process of this branched PUA endow it with great potentials in advanced electronic sensors.This article is protected by copyright. All rights reserved.
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