2020
DOI: 10.1016/j.rser.2019.109622
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Thermal transport properties of boron nitride based materials: A review

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Cited by 102 publications
(36 citation statements)
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“…BN is a refractory compound with heat and chemical stability having high thermal conductivity, high electrical resistivity, non-wettability, excellent lubricating properties and low dielectric constant. [20,24,25] It has been revealed that wear resistance of polymer can be improved by incorporating hydrophobic BN due to its lubricious nature. Also the high temperature resistance and low density properties makes them suitable for electronic packaging application.…”
Section: Boron Nitridementioning
confidence: 99%
“…BN is a refractory compound with heat and chemical stability having high thermal conductivity, high electrical resistivity, non-wettability, excellent lubricating properties and low dielectric constant. [20,24,25] It has been revealed that wear resistance of polymer can be improved by incorporating hydrophobic BN due to its lubricious nature. Also the high temperature resistance and low density properties makes them suitable for electronic packaging application.…”
Section: Boron Nitridementioning
confidence: 99%
“…Moreover, as evaluating temperature increased, the value of thermal conductivity was higher than the single component nanofluids [ 77 , 78 ]. h-BN contributed to the increase of the thermal conductivity as well as MoS 2 , promoting the dispersion of the nanostructures due to their lubricant properties [ 38 , 79 ].…”
Section: Resultsmentioning
confidence: 99%
“…Traditionally, aerogel is perceived as a superlight material being of extremely low thermal conductivity, which has overwhelming advantages in fields requiring super thermal insulation (Hu et al, 2019;Illera et al, 2018;Tychanicz-Kwiecie n et al, 2019). Contrary to the general aerogel, BN per se is well known for its brilliant thermal conductivity (Sharma et al, 2020). When the two extremes are combined, which side would the integrated BN aerogel stand?…”
Section: Bn Aerogels With Different Structural Hierarchy Display Similar Thermal Insulationmentioning
confidence: 99%