Thermal Transport in Oblique Finned Micro/Minichannels

Fan, Ying; Lee, Poh Seng; Singh, Pawan Kumar; Lee, Yong Jiun

doi:10.1007/978-3-319-09647-6

Cited by 2 publications

(1 citation statement)

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“…Moreover, they reported high-pressure drops (2 bars) for reaching minimal thermal resistance due to the small size of channels. Although utilizing a pump could compensate, the generated pressure drop which is used in conventional applications, using these pumps on a micro-scale is almost impossible [6]. The thermal boundary layer in convectional channels is maintained in a fully-developed state; thus, the thermal resistance increases and caused non-uniform heat transfer performance, leading to an unreliable platform and system failure.…”

Section: Introductionmentioning

confidence: 99%

Effective Parameters on Increasing Efficiency of Microscale Heat Sinks and Application of Liquid Cooling in Real Life

Alihosseini¹,

Bari²,

Mohammadi³

2021

Advances in Microfluidics and Nanofluids

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Over the past two decades, electronic technology and miniaturization of electronic devices continue to grow exponentially, and heat dissipation becomes a critical issue for electronic devices due to larger heat generation. So, the need to cool down electronic components has led to the development of multiple cooling methods and microscale heat sinks. This chapter reviewed recent advances in developing an efficient heat sink, including (1) geometry parameters, (2) flow parameters that affect the hydraulic–thermal performance of the heat sink. Also, the main goal of this chapter is to address the current gap between academic research and industry. Furthermore, commercialized electronic cooling devices for various applications are highlighted, and their operating functions are discussed, which has not been presented before.

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Section: Introductionmentioning

confidence: 99%