Thermal stress analysis on laser scribing of glass

Yamamoto, Koji; Hasaka, Noboru; Morita, Hideki; Ohmura, Etsuji

doi:10.2351/1.5060319

Cited by 5 publications

(6 citation statements)

References 3 publications

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“…利用非预制轨迹热裂法切割玻璃片时, 提升切割速度的一种有效方法是改变热源能量分布形状和施加冷却。Yamamoto 等 [24][25][26][27][28][29] 采用椭圆形分布 CO 2 激光+水冷的方法对玻璃进行热裂切割, 首先用金刚石砂轮在划切路径首端一侧玻璃平板边缘上表面预制裂纹缺口, 然后用椭圆形 CO 2 激光光斑进行热裂, 激光光斑尺寸为 22 mm2.1 mm, 最后在其扫描方向光斑后方随动喷水进行冷却以完成热裂切割。研究表明, 提高激光热源功率或施加冷却措施可使初始裂纹处的应力强度因子快速达到阈值, 以此提升切割速度。 2010 年美国康宁公司 Abramov 等 [30][31] 采用激光诱导热裂切割化学强化玻璃,他们采用线状光斑(椭圆光斑长轴长度与短轴长度的比值极大) 的 CO 2 激光, 对中心拉应力为 26~45 MPa 的 1 mm 厚的强化玻璃进行了激光诱导热裂切割。2011 年, 他们又实现了 1000 mm/s 的玻璃切割速度, 并且将切割后材料边缘处的残余应力值控制在 3. 49 [33] Fig.…”

Section: 切割速度unclassified

Research Progress of Thermal Controlled Cracking of Hard-Brittle Plate

Wang¹,

Wang²,

Wang³

et al. 2018

Journal of Inorganic Materials

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Thermal Controlled Cracking Method (TCCM) has developed for more than 60 years with great success. The research progress of TCCM in the past 60 years was reviewed in two directions, i.e. Premade Trajectory Cutting (PTC) and Non-Premade Trajectory Cutting (NPTC) respectively. For PTC, cutting velocity, trajectory deviation and sectional quality are the main process parameters to be optimized. For NPTC, cutting velocity and sectional quality are the main process parameters to be optimized. The crucial technique for optimizing these above parameters is to adopt new techniques for generating advanced heating source, cooling source and better process flow. These new techniques are expected to provide enormous promotion for the developing of TCCM.

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Section: 切割速度unclassified

Research Progress of Thermal Controlled Cracking of Hard-Brittle Plate

Wang¹,

Wang²,

Wang³

et al. 2018

Journal of Inorganic Materials

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“…Figure 11͑d͒ shows the condition when the cooling area is far away from the mask ͑W m Ͻ y t max ͒. 12 to be the threshold value of scribing enabled conditions obtained from the three-dimensional thermal stress analysis. 11͑a͒, after t max decreases gradually and reaches the local minimum.…”

Section: A Discontinuation Of Crack Propagation In the Scribing Dirementioning

confidence: 99%

“…As stated in the previous study, 12,13 based on the results of crack depth and crack profile obtained in laser scribing experiments, the authors conducted thermal stress analysis by using a finite element method ͑FEM͒ and proposed a laser scribing mechanism by means of a schematic of the cross section of the cooling area as shown in Fig. 1.…”

Section: Introductionmentioning

confidence: 99%

Partial growth of crack in laser scribing of glass

Yamamoto

Hasaka²,

Morita³

et al. 2009

Journal of Laser Applications

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Laser cutting ceramics using an unstable fracture technique Nd:YAG laser drilling of 8.3 mm thick partially stabilized tetragonal zirconia-control of recast layer microcracking using localized heating techniques The scribing of glass by a CO 2 laser is much more effective compared to the conventional mechanical technology in use because the strength of the cut glass is improved since microcracks and particles along the cut edge are lessened. However, the crack depth of laser scribing is limited because the inner compressive stress region under the cooling area prevents median crack growth. This fact was shown by the experimental and thermal stress analyses with a finite element method ͑FEM͒ in the authors' previous study. In this study, the glass was masked partially on the scribing line so as not to generate an inner compressive stress region, and the authors found that the median crack depth of laser scribing was deeper in the experiment. Thermal stress analysis of this phenomenon was conducted by using three-dimensional FEM. As a result, the stress distribution and the phenomenon of which the median crack grew deeper corresponded qualitatively well. It has been supported that the model of laser scribing mechanism proposed in the authors' previous study is valid.

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“…Due to the sharp temperature gradient in the thickness direction, a compressive stress is generated inside the glass, and a tensile stress is generated in the vicinity of the surface. The tensile stress causes the initial crack to propagate, and a shallow crack (hereinafter called a median crack) is produced on the surface along the laser beam scanning line [3].…”

Section: Introductionmentioning

confidence: 99%

“…It has been shown [4] that fewer particles are generated and the edge strength is increased through laser scribing under the condition of proper heat input. Yamamoto [3] has shown that a suitable range of scribing conditions can be estimated by a two-dimensional thermoelastic analysis, defining such processing conditions as suitable when a median crack is produced without damage. However the cause of the secondary cracks was not clarified.…”

Section: Introductionmentioning

confidence: 99%

3374 Dominant Factors of Suitable Processing Conditions in Laser Scribing of Glass

Yahata

Ohmura

Shimizu³

et al. 2011

LEM21

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In the laser scribing, when a median crack was produced without damage, such processing conditions were defined as suitable. Defining two kinds of damage, we investigated dominant factors of the range of suitable conditions by conducting thermoelastic analyses based on results of a laser scribing experiment and the photoelastic observation. Obtained conclusions are as follows: Generation of damage is dominated by the magnitude of the residual stress induced by the shear stress. Formation of a median crack is dominated by the maximum value of the tensile stress generated perpendicularly to the surfaces of a median crack.

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Thermal stress analysis on laser scribing of glass

Cited by 5 publications

References 3 publications

Research Progress of Thermal Controlled Cracking of Hard-Brittle Plate

Research Progress of Thermal Controlled Cracking of Hard-Brittle Plate

Partial growth of crack in laser scribing of glass

3374 Dominant Factors of Suitable Processing Conditions in Laser Scribing of Glass

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