1990
DOI: 10.1115/1.2904382
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Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moire´ Interferometry

Abstract: Fractional Fringe Moire´ Interferometry (FFMI)—a new experimental methodology to measure accurately deformations and consequently strains—has been successfully implemented to determine thermally induced strains in a specimen made from an AT&T 1MB DRAM device. The specimen was heated uniformly from room temperature to 90° C. Resulting moire´ fringe patterns were recorded, analyzed using digital-image-processing and in plane displacements in the device were determined. Strain components were computed by simp… Show more

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Cited by 33 publications
(13 citation statements)
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“…Moreover, the processing of fringe patterns is laborious and time-consuming. This technical difficulty has raised many researchers' attention and computerized procedures ( Bastawros and Voloshin, 1990) have been developed to automate the processing of the data from the fringe patterns.…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, the processing of fringe patterns is laborious and time-consuming. This technical difficulty has raised many researchers' attention and computerized procedures ( Bastawros and Voloshin, 1990) have been developed to automate the processing of the data from the fringe patterns.…”
Section: Introductionmentioning
confidence: 99%
“…Because of this disadvantage, the fringe binary method is not widely used. (4) Peak detection: Peak detection [29][30][31][32][33][34][35][36][37] means finding the local maxima or minima of the grayscale images. In this method, the whole image is SEM subjected to a peak detection matrix and the gray level of the pixels in the matrix is reduced to zero value if a peak does not exist and to logical F1_ if a peak is found.…”
Section: Fringe Centering Methodsmentioning
confidence: 99%
“…3 Porous materials are considered to be preferable as three-dimensional microchannels, and Bastawros et al 4 investigated cellular metal as a heat transfer medium. 1,2 To enhance the cooling performance of microchannels, three dimensional stacked microchannel heat sinks were investigated by Wey and Joshi.…”
Section: Introductionmentioning
confidence: 99%