Thermal stability of Cu/W nano-multilayers

Moszner, Frank; Cancellieri, Claudia; Chiodi, Mirco; Yoon, Songhak; Ariosa, D.; Janczak‐Rusch, Jolanta; Jeurgens, Lars P. H.

doi:10.1016/j.actamat.2016.02.003

Cited by 80 publications

(66 citation statements)

References 56 publications

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“…formation of line-shaped protrusions at the temperature higher than 500°Cand degradation of the nanolayered structure at temperatures higher than 700°C. The initial multilayer structures completely disintegrate into a nanocomposite structure, comprising globular W particles embedded in a Cu matrix [11].…”

Section: Introductionmentioning

confidence: 99%

Grain boundary driven Plateau–Rayleigh instability in multilayer nanocrystalline thin film: A phase-field study

2017

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Thermal stability of nanocrystalline multilayer thin film is of paramount importance as the applications often involve high temperature. Here we report on the layer instability phenomenon in binary polycrystalline thin film initiating from the grain boundary migrations at higher temperatures using phase-field simulations. Effect of layer thickness, bilayer spacing and the absence of grain boundary are also investigated along with the grain boundary mobility of individual phases on the layer stability. Layer instability in the polycrystalline film is shown to arise from the grain boundary grooving which originates spontaneously from the presence of grain boundaries. Our results show that the growth of the perturbation generated from the differential curvature follows Plateau-Rayleigh instability criterion. Increase in layer thickness, lower bilayer thickness as well as lower grain boundary mobility improve layer stability. Phase-field simulations show similar microstructural evolution as has been observed in our Zirconium (Zr)/Zirconium Nitride (ZrN) system experimentally. Detail analysis performed in this work to understand the mechanisms of layer instability leads us to predict measures which will improve the thermal stability of multilayer nanocrystalline thin film.

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Section: Introductionmentioning

confidence: 99%

Grain boundary driven Plateau–Rayleigh instability in multilayer nanocrystalline thin film: A phase-field study

2017

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“…As shown by these studies, in the as deposited state very high compressive stresses (related mainly to growth stresses initiate by the PVD process) were observed in the confined Cu (≈ -1.5 GPa) and W layers (≈ -3.5 GPa) [19]. Annealing up to 500 ºC fully releases the stresses of the Cu nanolayers [19], which also coincides with the temperature at which a high number of Cu protrusions appear on the surface [18]. At T > 700 ºC, degradation of the NML structure occurs [18,19].…”

Section: Methodsmentioning

confidence: 74%

“…2b and 3b). The microstructural evolution upon heating of the same Cu/W NML system (deposited on sapphire) has been studied in detail [18] and the corresponding stress evolution was comprehensively investigated [19]. As shown by these studies, in the as deposited state very high compressive stresses (related mainly to growth stresses initiate by the PVD process) were observed in the confined Cu (≈ -1.5 GPa) and W layers (≈ -3.5 GPa) [19].…”

Section: Methodsmentioning

confidence: 93%

“…Annealing up to 500 ºC fully releases the stresses of the Cu nanolayers [19], which also coincides with the temperature at which a high number of Cu protrusions appear on the surface [18]. At T > 700 ºC, degradation of the NML structure occurs [18,19]. Consequently, it is suggested for W 25nm + (Cu 5nm /W 5nm ) × 100 that upon heating (> 500 ºC) Cu penetrates through the W layers to the bond interface.…”

Section: Methodsmentioning

confidence: 99%

“…Subsequently degradation of the NML structure (> 700 ºC) by thermal grooving occurs (more details in Ref. [18]). Here it is emphasized that such Cu/W nano-composite structures can be very attractive for applications, where a combination of good thermal-and electrical conductivity with high mechanical properties is required.…”

Section: Methodsmentioning

confidence: 99%

See 2 more Smart Citations

Nano-Structured Cu/W Brazing Fillers for Advanced Joining Applications

Moszner¹,

Cancellieri²,

Becker³

et al. 2016

JMSE-B

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Nano-multilayered brazing fillers offer a high potential for joining heat sensitive materials at reduced temperatures. In the current work Cu/W based nano-multilayered coatings, fabricated via physical vapor deposition (PVD) are studied. Joints were successfully produced via deformation dilatometry at temperature of 750 ºC and a mechanism for the bonding process is suggested. The promising results indicate an attractive pathway for using the versatile ability of PVD to precisely control the microstructure on the nm-scale and enabling tunable joint properties.

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Ag Surface Outflow Kinetics in Ag/AlN Nanomultilayers

Druzhinin,

Janczak‐Rusch,

Cancellieri

2024

Physica Status Solidi (a)

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The heat‐induced microstructure evolution of nanomultilayers (NMLs) with metallic components is widely studied due to its critical importance in ensuring the reliable application of these nanomaterials. The thermal degradation of NMLs is controlled by mass transport of one of the NML components from the NML volume to its surface. The outflow occurs at temperatures well below the melting point of metal, offering new opportunities for the engineering of innovative NML‐based brazing fillers. A combined experimental‐modeling approach for the quantitative analysis of silver (Ag) outflow kinetics in Ag/AlN NMLs is presented. The method is based on in situ monitoring of the X‐ray diffraction intensity evolution of Ag acquired from the near‐surface region of NML (grazing incidence geometry) upon annealing in the temperature range of 230–425 °C (atmosphere of N2). The experimental data are compared to model predictions of Ag diffusion. It is assumed that Ag diffusion is driven by the relaxation of residual stresses in Ag nanolayers. Due to the multilayer geometry, the surface outflow kinetics are mainly defined by the kinetics of Ag diffusion along Ag/AlN interphase boundaries. The parameters defining the Ag surface outflow kinetics, i.e., diffusion coefficients and activation energy for diffusion, are derived.

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Thermal stability of Cu/W nano-multilayers

Cited by 80 publications

References 56 publications

Grain boundary driven Plateau–Rayleigh instability in multilayer nanocrystalline thin film: A phase-field study

Grain boundary driven Plateau–Rayleigh instability in multilayer nanocrystalline thin film: A phase-field study

Nano-Structured Cu/W Brazing Fillers for Advanced Joining Applications

Ag Surface Outflow Kinetics in Ag/AlN Nanomultilayers

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