Thermal stability and electrical properties of Ag–Ti films and Ti/Ag/Ti films prepared by sputtering

Kawamura, Midori; Zhang, Ziyang; Kiyono, Ryotaro; Abe, Yoshio

doi:10.1016/j.vacuum.2012.02.021

Cited by 26 publications

(17 citation statements)

References 8 publications

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“…For example, the addition of an external element can improve the well-known properties of pure Ti by the formation of intermetallic-like compounds. Silver (Ag) or copper (Cu) are examples of stabilizing elements, which combine the properties of both materials (Ti and Ag/Cu), without significant differences in biocompatibility [11][12][13][14] [15]. The functional properties of intermetallic compounds or alloys are often better than to those of ordinary metals, particularly at high temperatures, due to their mixed bonding (metallic, covalent and ionic) and specific stoichiometry [16].…”

Section: Introductionmentioning

confidence: 99%

“…In this particular case, the annealing treatment is often claimed to be one of the easiest ways to achieve the required structural and morphological stability of the system [18,26]. The energy supplied by annealing processes causes recovery effects (stress relaxation) that involves migration, recombination and eradication of point defects, rearrangement and annihilation of dislocations and also growth and coalescence of subgrains [3,14,18,23,24,[27][28][29][30].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Evolution of the functional properties of titanium–silver thin films for biomedical applications: Influence of in-vacuum annealing

Lopes

Gonçalves

Borges

et al. 2015

Surface and Coatings Technology

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Evolution of the functional properties of titanium–silver thin films for biomedical applications: Influence of in-vacuum annealing

Lopes

Gonçalves

Borges

et al. 2015

Surface and Coatings Technology

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“…Jamnig et al studied the effect of nitrogen gas surfactant on the growth evolution of nanoscale silver films on silicon dioxide substrates, and the results show that early nitrogen deployment leads to 2D morphology without affecting the resistivity of silver film [ 13 ]. Kawamura et al studied the suppression effect of titanium atoms on the agglomeration of thin silver film, and they found that adding titanium atoms can improve the adhesion of silver film to substrate [ 14 ]. Pliatsikas et al studied the surface morphological evolution of magnetron-sputtered thin silver films deposited on silicon dioxide substrates, and found that silver layers grow flatter in the oxygen-containing gas atmosphere due to incomplete island coalescence.…”

Section: Introductionmentioning

confidence: 99%

Atomistic Insights into Aluminum Doping Effect on Surface Roughness of Deposited Ultra-Thin Silver Films

et al. 2021

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Ultra-thin and continuous metallic silver films are attracting growing interest due to the applications in flexible transparent conducting electrodes. The surface morphology and structure of silver film are very important for its electrical resistivity and optical loss. Therefore, roughness control is essential for the production of ultra-thin metallic electrode film. We have investigated the effect of aluminum doping on the improvement of surface morphology of ultra-thin silver films using molecular dynamics simulations. Al-doped silver films showed smaller surface roughness than pure silver films at various substrate temperatures. When the temperature of the substrate was 600 K, the roughness of Al-doped silver film first decreased, and then increased with the increase of the incident velocity of silver atoms. Silver atoms were more likely to agglomerate on the surface of the substrate after adding aluminum atoms, as aluminum dopants promoted the immobilization of silver atoms on SiO2 substrate due to the anchoring effect. The smoother surface could be attributable to the reduced mean free path of silver due to the cage effect by the aluminum dopant.

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“…Conventional solar cells normally achieve light trapping with three methods, a textured front surface, a highly reflective rear reflector and an antireflection coating [4][5][6]. Silver (Ag) is the conventional metal for back reflectors, but its drawbacks are high price, low adhesion and agglomeration behavior [7][8][9]. Therefore, researchers are searching for a cheaper alternative.…”

Section: Introductionmentioning

confidence: 99%

Aluminum–Titanium Alloy Back Contact Reducing Production Cost of Silicon Thin-Film Solar Cells

Hsu

Lien

et al. 2016

Energies

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Abstract:In this study, metal films are fabricated by using an in-line reactive direct current magnetron sputtering system. The aluminum-titanium (AlTi) back contacts are prepared by changing the pressure from 10 mTorr to 25 mTorr. The optical, electrical and structural properties of the metal back contacts are investigated. The solar cells with the AlTi had lower contact resistance than those with the silver (Ag) back contact, resulting in a higher fill factor. The AlTi contact can achieve a solar cell conversion efficiency as high as that obtained from the Ag contact. These findings encourage the potential adoption of AlTi films as an alternative back contact to silver for silicon thin-film solar cells.

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Thermal stability and electrical properties of Ag–Ti films and Ti/Ag/Ti films prepared by sputtering

Cited by 26 publications

References 8 publications

Evolution of the functional properties of titanium–silver thin films for biomedical applications: Influence of in-vacuum annealing

Evolution of the functional properties of titanium–silver thin films for biomedical applications: Influence of in-vacuum annealing

Atomistic Insights into Aluminum Doping Effect on Surface Roughness of Deposited Ultra-Thin Silver Films

Aluminum–Titanium Alloy Back Contact Reducing Production Cost of Silicon Thin-Film Solar Cells

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