Thermal stability and dynamic mechanical thermal analysis of epoxy thermosets possessing N,N′-disubstituted pyromellitimide units

Ahmadi-khaneghah, Aziz; Behniafar, Hossein; Pourali, Ali Reza

doi:10.1080/1023666x.2020.1805182

Cited by 3 publications

(3 citation statements)

References 30 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…[6][7][8][9] However, despite all the advantages that such epoxy/amine systems have, these materials face a major disadvantage, which is the high brittleness of their films. 10,11 One method to overcome this drawback is to utilize resins or curing agents bearing flexible structures such as polyoxyalkylene glycidyl ethers [12][13][14][15] and various types of Jeffamine curing agents. [16][17][18][19] Nevertheless, to avoid substantial damages in the physico-mechanical properties, this class of structurally pliable monomers must be employed together with other monomers possessing hard and rigid structures.…”

Section: Introductionmentioning

confidence: 99%

Binary Resin-Curing Agent Systems for Fabricating Epoxy and Graphene Oxide-loaded Epoxy Films

Ahmadi-khaneghah

Khosravi-ardakani

Jahani

et al. 2023

High Performance Polymers

Self Cite

View full text Add to dashboard Cite

In this research, diglycidyl ethers of bisphenol-A (BADGE) and polyethylene glycol (PEGDGE) were binarily cured with a mixture of diamine curing agents including isophorone diamine and polyethylene glycol diamine (PEGDA) in the absence/presence of aminated graphene oxide nanoplatelets (AGNPs, 0.5 wt.%). Four molar ratios of diglycidyl ethers and curing agents were used stoichiometrically in isothermal curing systems. The films prepared from the epoxy networks were entirely strong and pliable. All epoxy thermosets were evaluated using field emission-scanning electron microscopy (FE-SEM), Fourier transform infrared (FT-IR) spectroscopy, X-ray diffraction (XRD), and diffuse reflectance-ultraviolet/visible spectroscopy (DR-UV/vis). The absorption coefficients of the epoxy and AGNPs-loaded epoxy materials decreased with increasing the molar ratio of PEGDGE resin and polyethylene glycol diamine curing agent. According to dynamic mechanical analysis no phase heterogeneity occurred in the structure of the prepared thermostats. When the thermoset materials were loaded by AGNPs filler, the peaks associated with alpha relaxations shifted to higher temperatures. Moreover, thermogravimetric analysis demonstrated that the thermal stability of the prepared epoxy thermosets slightly increased after the addition of the nanoplatelets. In addition, the thermal resistance of the prepared thermosets decreased to some extent by increasing the participation rate of monomers containing polyoxyethylene.

show abstract

Section: Introductionmentioning

confidence: 99%

Binary Resin-Curing Agent Systems for Fabricating Epoxy and Graphene Oxide-loaded Epoxy Films

Ahmadi-khaneghah

Khosravi-ardakani

Jahani

et al. 2023

High Performance Polymers

Self Cite

View full text Add to dashboard Cite

show abstract

“…Nevertheless, the end of hardening processes is checked by some techniques such as IR and DSC. Recently, we have focused our studies on the preparation and characterization of epoxy and nanofiller‐loaded epoxy thermosets through applying isothermal curing processes 29–32 . In continuation of these efforts, in the current work, the idea of simultaneously curing two epoxy resins in two different percentages with an amine‐based curing agent called 4,4′‐diaminodiphenyl sulfone was used to improve the thermo‐mechanical properties.…”

Section: Introductionmentioning

confidence: 99%

“…Recently, we have focused our studies on the preparation and characterization of epoxy and nanofiller-loaded epoxy thermosets through applying isothermal curing processes. [29][30][31][32] In continuation of these efforts, in the current work, the idea of simultaneously curing two epoxy resins in two different percentages with an amine-based curing agent called 4,4 0 -diaminodiphenyl sulfone was used to improve the thermo-mechanical properties. The main resin is a diglycidyl ether of bisphenol A (DGEBPA), which is very popular in the epoxy industry.…”

Section: Introductionmentioning

confidence: 99%

Simultaneously cured diglycidyl ethers of bisphenol A and polyethylene glycol: DSC, TGA, and DMA measurements

Ghallemohamadi,

Heydari,

Jahani

et al. 2023

Polymers for Advanced Techs

Self Cite

View full text Add to dashboard Cite

In this study, to improve the physico‐mechanical properties of epoxy thermosets, simultaneous curing of two resins with a stoichiometric amount of an aromatic amine hardener was investigated. The two resins used included the well‐known diglycidyl ether of bisphenol A (DGEBPA) with relatively rigid molecular structure and a diglycidyl ether derived from a popular polymer, polyethylene glycol (PEG), with loose molecular structure (DGEPEG). DGEPEG was used in amounts of 10 and 25 mol% in the resin mixture. A single‐resin curing process, including only DGEBA, was also examined. Before isothermal curing, differential scanning calorimetry (DSC) was used to determine the position of the curing exotherm. To ensure the completion of the curing processes, infra‐red (IR) and DSC techniques were performed on both simultaneously‐cured thermosets and the control thermoset. The thermogravimetric analysis (TGA) of the prepared thermosets showed that the addition of DGEPEG resin in the curing process of DGEBA resin has no significant effect on reducing the thermal resistance of the thermoset. In addition, the storage moduli (E′) and the damping coefficients (tan δ) were measured by dynamic mechanical analysis (DMA). As the mole percentage of DGEPEG resin increased, the rapid drop in the E′ value and the α‐relaxation, which is a measure of the glass transition (Tg), occurred at lower temperatures.

show abstract

Fluorinated anhydride-terminated imide oligomers toward high-performance epoxy thermosets enabled by hydroxyl elimination and low dielectric polarizability strategy

Liu

Zhou

et al. 2022

Chemical Engineering Journal

View full text Add to dashboard Cite

Thermal stability and dynamic mechanical thermal analysis of epoxy thermosets possessing N,N′-disubstituted pyromellitimide units

Cited by 3 publications

References 30 publications

Binary Resin-Curing Agent Systems for Fabricating Epoxy and Graphene Oxide-loaded Epoxy Films

Binary Resin-Curing Agent Systems for Fabricating Epoxy and Graphene Oxide-loaded Epoxy Films

Simultaneously cured diglycidyl ethers of bisphenol A and polyethylene glycol: DSC, TGA, and DMA measurements

Fluorinated anhydride-terminated imide oligomers toward high-performance epoxy thermosets enabled by hydroxyl elimination and low dielectric polarizability strategy

Contact Info

Product

Resources

About