2016
DOI: 10.1088/0031-8949/t167/1/014015
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Thermal shock tests to qualify different tungsten grades as plasma facing material

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Cited by 70 publications
(48 citation statements)
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“…The cracking in single-track scanning of SLM was also reported in SLM of Al-based metallic glass by Li et al [14]. The cracking in single molten track also matches well with the thermal shock tests of tungsten [19,20].…”
Section: Crack Network In Slm-derived Tungstensupporting
confidence: 81%
See 1 more Smart Citation
“…The cracking in single-track scanning of SLM was also reported in SLM of Al-based metallic glass by Li et al [14]. The cracking in single molten track also matches well with the thermal shock tests of tungsten [19,20].…”
Section: Crack Network In Slm-derived Tungstensupporting
confidence: 81%
“…Similar cracking behavior was also reported by Farid et al [18], who investigated the cracking behavior under long laser pulse load. Wirtz et al [19,20] tested the thermal shock impact of an electron beam on tungsten and further proved that the microstructure would affect the crack distribution and density. In the SLM process, the laser parameters, especially the scanning strategy, have a considerable influence on the final microstructure and thus affect the cracking behavior.…”
Section: Introductionmentioning
confidence: 99%
“…The early necking deformation therefore occurs resulting in the low uniform elongation. Note that the obtained here data are fully compatible with the results presented for IG1000 (but tested at 300°C and 500°C) in Wirtz et al [34]. These pronounced differences in the uniform elongation of SPS and ITER specification material could be related to the reduced dislocation density (due to high temperature sintering of SPS materials), while differences in grain boundary morphology should also have an impact on the results.…”
Section: 3-tensile Testsupporting
confidence: 90%
“…Recent efforts to characterise damage from such thermal shock events have focussed on metallic tungsten and its alloys, which are the primary candidate plasma-facing materials [2][3][4][5][6][7][8]. Tungsten's advantages are its high thermal conductivity and melting point, however its low temperature brittleness and relatively low fracture toughness mean that it is susceptible to extensive thermal stress-induced crack formation -even after a single pulse [8].…”
Section: Introductionmentioning
confidence: 99%
“…In multipulse loading, the crack morphology is heavily influenced by microstructure. In rolled tungsten plate, where the grain network is highly textured, the orientation of the long-axes of the grains relative to the thermally exposed surface plays a key role [3][4][5]. When these axes are within the surface, the in-plane mechanical properties are enhanced, leading to a higher power threshold for crack formation [3][4][5].…”
Section: Introductionmentioning
confidence: 99%