2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2020
DOI: 10.1109/itherm45881.2020.9190609
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Thermal Sensor Placement based on Meta-Model Enhancing Observability and Controllability

Yunhyeok Im
1
,
Wook Kim
2
,
Taekeun An
3
et al.
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Cited by 6 publications
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References 16 publications
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On-Chip Transient Hot Spot Detection with a Multiscale ROM in 3DIC Designs

Geb
1
,
Asgari
2
,
Kumar
3
et al. 2022
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
3
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On-Chip Transient Hot Spot Detection with a Multiscale ROM in 3DIC Designs

Geb
1
,
Asgari
2
,
Kumar
3
et al. 2022
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
3
0
0
0
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Methodology for Accurate Hotspot Prediction by Upscale Spatiotemporal Resolution of Temperature Sensing using a Power Meter and Resistor-Capacitor Thermal Model

An
1
,
Im
2
,
Yoo
3
et al. 2021
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Finding the minimum quantity and the optimum placement of on-die temperature sensor in SOC design based on rank analysis

Lee
1
,
Im
2
,
An
3
et al. 2021
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
1
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