Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization. I. Fundamentals and theory

Bagnoli, Paolo; Casarosa, Claudio; Ciampi, Mario; Dallago, E.

doi:10.1109/63.728348

Cited by 178 publications

(78 citation statements)

References 5 publications

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“…That is, the dynamics is controlled by the thermal resistances and thermal masses of the system [7]. The dynamic behavior of the system is described by a nonhomogenous differential heat transfer equation for solid [4].…”

Section: Dynamic Behavior Of a Thermal Tem Systemmentioning

confidence: 99%

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Modeling and Analysis of Thermoelectric Modules

Lineykin

Ben‐Yaakov

2007

IEEE Trans. on Ind. Applicat.

340

120

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Abstract-The objective of this paper is to develop a SPICEcompatible equivalent circuit of a thermoelectric module. A methodology is developed for extracting the parameters of the proposed model from manufacturers' data of thermoelectric coolers (TECs) and thermoelectric generators (TEGs). The model could be helpful in analyzing the drive requirements of TECs and loading effects of TEGs. The present model is compatible with PSPICE or other electric circuit simulators. An important feature of the model is its ability to generate small-signal transfer functions that can be used to design feedback networks for temperature control applications.

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Section: Dynamic Behavior Of a Thermal Tem Systemmentioning

confidence: 99%

“…6. Clearly, the ceramic plates, heat sink, thermal load, etc., also need to be represented as lumped capacitances or thermal impedances using the suggested method or other common methods as proposed in [7]. By increasing the number of nodes in the model, one improves the precision of the solution.…”

Section: Dynamic Behavior Of a Thermal Tem Systemmentioning

confidence: 99%

Modeling and Analysis of Thermoelectric Modules

Lineykin

Ben‐Yaakov

2007

IEEE Trans. on Ind. Applicat.

340

120

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“…In the shown configuration, the copper busbars and other interconnections also contribute a small part to the total shunt resistance (< 10 %) and to the overall temperature coeffi- (Grundkötter, 2016). cient. Because the temperature coefficient of copper is quite high (≈ 3900 ppm K −1 ), the additional resistance increases the total temperature coefficient to α TK ≈ 600 ppm K −1 .…”

Section: Shunt Resistor: Temperature Coefficientmentioning

confidence: 99%

High-accuracy current measurement with low-cost shunts by means of dynamic error correction

Weßkamp

Melbert

2016

J. Sens. Sens. Syst.

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Abstract. Measurement of electrical current is often performed by using shunt resistors. Thermal effects due to self-heating and ambient temperature variation limit the achievable accuracy, especially if low-cost shunt resistors with increased temperature coefficients are utilized. In this work, a compensation method is presented which takes static and dynamic temperature drift effects into account and provides a significant reduction of measurement error. A thermal model of the shunt resistor setup is derived for this purpose and a suitable calibration method is developed. The correction algorithm is based upon a digital filter bank and is optimized for microcontrollers with low computational complexity. It is implemented in laboratory test equipment for long-term studies on automotive lithium-ion cells. For a 600 A current pulse, it reduces the measurement error from 2 % to less than 0.1 %. Measurements with a real-life testing profile show a reduction of remaining measurement error by 60 %. Statistical results for 100 test systems and long-term drift measurements prove the reliability of the method. The proposed dynamic error correction algorithm therefore allows high measurement accuracy despite the use of low-cost shunt resistors.

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“…At present, the most widely used method of online junction temperature evaluation is the junction temperature estimation based on the thermal network [68]- [74].This method is implemented by two steps, firstly, the loss of power devices is calculated according to the operating conditions, and then the junction temperature is calculated by the case temperature and the thermal network.The thermal network parameters can be extracted by finite element method, analytic model method, extended description function method, polynomial fitting, equivalent RC thermal network etc. [75]- [77].…”

Section: A Junction Temperature Evaluationmentioning

confidence: 99%