1974
DOI: 10.1063/1.1662949
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Thermal relaxation at interfaces following shock compression

Abstract: Thermal conduction processes at material interfaces representative of those produced by shock compression are studied in order to understand the temperature history at the interface. The transient effects due to small gaps and thin layers are calculated, as well as the modifications due to a melting transition in one of the materials.

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Cited by 92 publications
(34 citation statements)
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“…This further established that in the CsI-LiF sandwich shots the decaying signal was that of the temperature of the CsILiF interface and not the shock front in the LiF. For the case of a shocked interface gap or layer (region 1, with half-width a) sandwiched between a transparent window material (region 2) and an initially-shocked target material (region 3), Grover and Urtiew [3] derive using the method of images and Green's functions the following equation for the interface temperature T 1 as a function of dimensionless thermal diffusion time τ = tκ/a 2 , and ratios of material properties (thermal diffusivity, density, specific heat) subsumed in the variables α and β :…”
Section: The Experiments and Resultsmentioning
confidence: 99%
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“…This further established that in the CsI-LiF sandwich shots the decaying signal was that of the temperature of the CsILiF interface and not the shock front in the LiF. For the case of a shocked interface gap or layer (region 1, with half-width a) sandwiched between a transparent window material (region 2) and an initially-shocked target material (region 3), Grover and Urtiew [3] derive using the method of images and Green's functions the following equation for the interface temperature T 1 as a function of dimensionless thermal diffusion time τ = tκ/a 2 , and ratios of material properties (thermal diffusivity, density, specific heat) subsumed in the variables α and β :…”
Section: The Experiments and Resultsmentioning
confidence: 99%
“…Grover and Urtiew [3] make the observation that since ρc v is relatively constant over a wide range of materials, the simplifying assumptions of α = k 1 /k 2 and β = k 1 /k 3 can be made. Shown in Figure 3 are some preliminary calculations of the temporal decay of temperature in these CsI-LiF shock experiments, for CsI shocked to about 40 GPa, with a 1-μm interfacial gap (layer).…”
Section: The Experiments and Resultsmentioning
confidence: 99%
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“…Liquid windows, such as zinc chloride 60 or liquid xenon, 61 avoid the etalon problem but may create other challenges; a liquid bonding layer, such as hexane might be a useful compromise. Interface issues are a recurring problem in dynamic temperature measurements 62,63 and will continue to be an issue with gold sensors.…”
Section: Sample-adhesion Layer-gold Sensor↔bond Layer↔windowmentioning
confidence: 99%