Thermal properties of polyetherimide/polycarbonate blends for advanced applications

Blanco, Ignazio; Cicala, Gianluca; Ognibene, Giulia; Rapisarda, Mario; Recca, A.

doi:10.1016/j.polymdegradstab.2018.06.011

Cited by 33 publications

(31 citation statements)

References 15 publications

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“…As a very successful colorless aromatic PI, 6FDA/TFMB PI exhibits high transparency in the visible region, whereas the thermal properties are not good enough ( T g ~ 300 °C and CTE ~ 150 ppm/°C) to resist the high processing temperature during the fabrication of flexible display [3]. Based on this case, octafunctional POSS was combined with 6FDA/TFMB to obtain hybrid PI to improve the thermal properties.…”

Section: Resultsmentioning

confidence: 99%

“…Polyimide (PI) is widely used in the microelectronics and aerospace industries because of its excellent thermal stability, chemical resistance and suitability for advanced manufacturing [1,2,3]. Optically transparent PIs with high thermal resistance have drawn great attention due to their extensive applications as transparent flexible substrates of optoelectronic devices, such as image displays, organic photovoltaics, printing circuit boards, and touch panels [4].…”

Section: Introductionmentioning

confidence: 99%

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Transparent, High Glass-Transition Temperature, Shape Memory Hybrid Polyimides Based on Polyhedral Oligomeric Silsesquioxane

et al. 2019

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Optically transparent polyimides with excellent thermal stability and shape memory effect have potential applications in optoelectronic devices and aerospace industries. A series of optically transparent shape memory polyimide hybrid films are synthesized from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 2,2′-bis-(trifluoromethyl)biphenyl-4,4′-diamine (TFMB) with various polyhedral oligomeric silsesquioxane (POSS) contents and then subjected to thermal imidization. The hybrid films show good optical transparency (>80% at 400 nm and >95% at 500 nm) with cutoff wavelengths ranging from 318 to 336 nm. Following the incorporation of the inorganic POSS structure, the hybrid films exhibit excellent thermal stability with glass transition temperature (Tg) ranging from 351 to 372 °C. The hybrid films possess the highest Tg compared with the previously-reported shape memory polymers. These findings show that POSS is successfully utilized to develop transparent polyimides with excellent thermal stability and shape memory effect.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Transparent, High Glass-Transition Temperature, Shape Memory Hybrid Polyimides Based on Polyhedral Oligomeric Silsesquioxane

et al. 2019

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“…It can be chemically metallized, and it is not resistant to ketones, chloroform, ethyl acetate, and methyl ethyl ketone. Moreover, it is inherently flame retardant [ 154 , 155 , 156 , 157 , 158 , 159 , 160 ].…”

Section: Thermoplastics For Midmentioning

confidence: 99%

3D-MID Technology for Surface Modification of Polymer-Based Composites: A Comprehensive Review

et al. 2020

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The three-dimensional molded interconnected device (3D-MID) has received considerable attention because of the growing demand for greater functionality and miniaturization of electronic parts. Polymer based composite are the primary choice to be used as substrate. These materials enable flexibility in production from macro to micro-MID products, high fracture toughness when subjected to mechanical loading, and they are lightweight. This survey proposes a detailed review of different types of 3D-MID modules, also presents the requirement criteria for manufacture a polymer substrate and the main surface modification techniques used to enhance the polymer substrate. The findings presented here allow to fundamentally understand the concept of 3D-MID, which can be used to manufacture a novel polymer composite substrate.

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“…The literature dates back to 1984, with the development of stereolithography and thus the advent of commercial additive manufacturing (AM), the beginning of the third Industrial Revolution [1,2]. The term stereolithography was coined by Charles ("Chuck") Hull in 1984 when he applied for a patent on the process [3].…”

Section: Introductionmentioning

confidence: 99%

The Use of Composite Materials in 3D Printing

Blanco

2020

J. Compos. Sci.

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111

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Nowadays, all production, from the smallest ones to large companies, and research activities are affected by the use of 3D printing technology. The major limitation, in order to cover as many fields of application as possible, is represented by the set of 3D printable materials and their limited spectrum of physico-chemical properties. To expand this spectrum and employ the 3D-printed objects in areas such as biomedical, mechanical, electronical and so on, the introduction of fibers or particles in a polymer matrix has been widely studied and applied. In this review, all those studies that proposed modified polymer presenting advantages associated with rapid prototyping are reported.

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Thermal properties of polyetherimide/polycarbonate blends for advanced applications

Cited by 33 publications

References 15 publications

Transparent, High Glass-Transition Temperature, Shape Memory Hybrid Polyimides Based on Polyhedral Oligomeric Silsesquioxane

Transparent, High Glass-Transition Temperature, Shape Memory Hybrid Polyimides Based on Polyhedral Oligomeric Silsesquioxane

3D-MID Technology for Surface Modification of Polymer-Based Composites: A Comprehensive Review

The Use of Composite Materials in 3D Printing

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