Thermal Properties of a Chemically Amplified Resist Resin

Asakawa, Koji; Hongu, Akinori; Oyasato, Naohiko; Nakase, Makoto

doi:10.1021/bk-1994-0579.ch013

Cited by 2 publications

(4 citation statements)

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“…7 The quantitative relationship between baking temperature and thermal decomposition has been already reported. This indicated that the remaining solvent can be reduced increasing the prebake temperature.…”

Section: Resultsmentioning

confidence: 88%

“…7 BCM-PHS was synthesized by reaction of t-butoxycarbonyl-␣-bromoacetate with poly͑4-hydroxystyrene͒ ͑PHS͒ ͑M w ϭ5.1ϫ10 3 ͒ in the presence of potassium carbonate and potassium iodide according to the literature. 7 BCM-PHS was synthesized by reaction of t-butoxycarbonyl-␣-bromoacetate with poly͑4-hydroxystyrene͒ ͑PHS͒ ͑M w ϭ5.1ϫ10 3 ͒ in the presence of potassium carbonate and potassium iodide according to the literature.…”

Section: A Materialsmentioning

confidence: 99%

“…7 BCM-PHS was synthesized by reaction of t-butoxycarbonyl-␣-bromoacetate with poly͑4-hydroxystyrene͒ ͑PHS͒ ͑M w ϭ5.1ϫ10 3 ͒ in the presence of potassium carbonate and potassium iodide according to the literature. 7 The p-t-butoxycarbonyl group of BCM, referred to as an inhibitor in this article, makes this resist insoluble to an alkaline developer. The glass transition temperatures ͑T g ͒ of this PHS and BCM-PHS are 146 and 111°C, respectively, from our differential scanning calorimetry ͑DSC͒ measurements.…”

Section: A Materialsmentioning

confidence: 99%

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Effect of remaining solvent on sensitivity, diffusion of acid, and resolution in chemical amplification resists

Asakawa

Ushirogouchi

Nakase

1995

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Polymer structure effect on dissolution characteristics and acid diffusion in chemically amplified deep ultraviolet resists J. Vac. Sci. Technol. B 15, 2541 (1997; 10.1116/1.589681Acid-diffusion suppression in chemical amplification resists by controlling acid-diffusion channels in base matrix polymers J.The effect of the remaining solvent on the diffusion of the catalytically active acid within the chemical amplification resists is discussed. A range of solvents was investigated from the viewpoint of sensitivity, diffusion, and resolution. The solvent remaining after the coating and baking processes is thought to one of the most probable factors among the several possible causes in the determination of the performance of the resists. It is also considered to result in the environmental instability which is currently one of the most serious problems in the use of the resists of this type. The remaining solvent drastically enhances the thermal diffusion of acid generated from photo-acid generators upon photoanalysis. The log of the diffusion range of the acid is found to be proportional to the concentration of the remaining solvent. This phenomenon may be described by a theory which combines the hole theory of liquids and the free volume theory of polymers and was also found to be the correlation energy between resin, solvent, and acid. In practice, this enhancement of diffusion range by remaining solvent does not result in higher sensitivity but rather degrades the performance of the resists.

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Section: Resultsmentioning

confidence: 88%

Section: A Materialsmentioning

confidence: 99%

“…7 BCM-PHS was synthesized by reaction of t-butoxycarbonyl-␣-bromoacetate with poly͑4-hydroxystyrene͒ ͑PHS͒ ͑M w ϭ5.1ϫ10 3 ͒ in the presence of potassium carbonate and potassium iodide according to the literature. 7 The p-t-butoxycarbonyl group of BCM, referred to as an inhibitor in this article, makes this resist insoluble to an alkaline developer. The glass transition temperatures ͑T g ͒ of this PHS and BCM-PHS are 146 and 111°C, respectively, from our differential scanning calorimetry ͑DSC͒ measurements.…”

Section: A Materialsmentioning

confidence: 99%

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Effect of remaining solvent on sensitivity, diffusion of acid, and resolution in chemical amplification resists

Asakawa

Ushirogouchi

Nakase

1995

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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“…2, because the difference in the sensitivity between trifluoromethanesulfonate and p-toluenesulfonate resists diminished at higher temperature. Actually, it has been reported that phenolic hydroxyl groups of PHS, which has weak acidity (PKa8l = -1), dissociate and work as a catalyst for decomposition of t-Boc and carboxylic ester groups at high PEB temperatures [15][16][17].…”

Section: Methodsmentioning

confidence: 99%

Effect of Dissociation Constant of Catalytic Acids on the Characteristics of Chemically Amplified Resists.

Nakamura¹,

Ban²,

Tanaka³

1997

J. Photopol. Sci. Technol.

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We investigate the influence of the strength of catalytic acids on the characteristics of chemically amplified positive resists composed of t-Boc-protected-polyhydroxystyrene and acid generators. It is clarified that weaker acidity results in a stronger dependence of resist sensitivity on post-exposure baking temperature and a smaller dissolution rate contrast for development.These phenomena can be explained in terms of the degree of dissociation of acid molecules.Effects of the degree of dissociation on the image contrast and stability for basic contaminants are also discussed quantitatively.

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Thermal Properties of a Chemically Amplified Resist Resin

Cited by 2 publications

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Effect of remaining solvent on sensitivity, diffusion of acid, and resolution in chemical amplification resists

Effect of remaining solvent on sensitivity, diffusion of acid, and resolution in chemical amplification resists

Effect of Dissociation Constant of Catalytic Acids on the Characteristics of Chemically Amplified Resists.

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