Thermal Plasma‐Induced Surface Modifications Correlated With the Field Emission Properties of Copper
Sajid Ali,
Mahreen Akram,
Shazia Bashir
et al.
Abstract:The present work deals with the Argon (Ar) Thermal plasma‐induced surface modification of Cu and its correlation with the electrical and field emission (FE) properties. Polycrystalline Cu targets were treated with Ar thermal plasma under atmospheric pressure at different treatment times ranging from 5 min to 30 min. XRD patterns revealed the absence of new phase in treated samples. However, significant variation in peak intensities and shifting is observed, which is explained on the basis of thermal plasma ion… Show more
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