2009
DOI: 10.1016/j.applthermaleng.2009.06.013
|View full text |Cite
|
Sign up to set email alerts
|

Thermal performance study of integrated cold plate with power module

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

1
11
0

Year Published

2013
2013
2024
2024

Publication Types

Select...
8
1

Relationship

0
9

Authors

Journals

citations
Cited by 55 publications
(12 citation statements)
references
References 10 publications
1
11
0
Order By: Relevance
“…Also, the flow turbulence (water disturbance) caused by the bigger flow rate in the inlet area of the multi-layer manifold microchannel the increases heat transfer coefficient. A similar phenomenon was mentioned by other researchers in references [32,33]. Therefore, the increase of the heat transfer coefficient is partially ascribed to up-down arranged manifolds and plenum chambers.…”
Section: Heat Transfer Coefficientsupporting
confidence: 63%
“…Also, the flow turbulence (water disturbance) caused by the bigger flow rate in the inlet area of the multi-layer manifold microchannel the increases heat transfer coefficient. A similar phenomenon was mentioned by other researchers in references [32,33]. Therefore, the increase of the heat transfer coefficient is partially ascribed to up-down arranged manifolds and plenum chambers.…”
Section: Heat Transfer Coefficientsupporting
confidence: 63%
“…Under various driving conditions, the experimental results were similar to the model results, meaning that the inverter model is reliable. When Zhang et al [19] assessed the heat transfer performance with respect to the flow structure of coolant IGBT modules, the temperature difference between the experiment and the model analysis was about 10 °C. Compared with the total heat generation of 185.2 W, which was used in the model analysis, the heat released via the coolant in the cold plates was approximately 89% of that amount, i.e., 164.7 W. When the amount of coolant increased from 2 L/min to 6 L/min, the MOSFET temperature decreased by 3.3 °C.…”
Section: Liquid-cooled Invertermentioning
confidence: 99%
“…When the radar works under high temperature environment, the cooling system operates in the main cooling way: liquid cooling; when fault occurs in the primary cooling system, it starts the auxiliary cooling system: air cooling [9]. Zhang et al proposed a method for active phased array antenna with baffles S-type cold to avoid heat concentration while increasing the heat transfer area [10], but not for the cold plate structure optimization. The microchannel heat sink of air cooling is used in certain avionics, and the operation performance of the microchannel heat sink is studied [11].…”
Section: Introductionmentioning
confidence: 99%