2009 11th Electronics Packaging Technology Conference 2009
DOI: 10.1109/eptc.2009.5416470
|View full text |Cite
|
Sign up to set email alerts
|

Thermal performance of PCM-cooled mobile phone

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2015
2015
2019
2019

Publication Types

Select...
3
1

Relationship

0
4

Authors

Journals

citations
Cited by 4 publications
(1 citation statement)
references
References 8 publications
0
1
0
Order By: Relevance
“…They reported that the PCM can stabilize the temperature of the system and extend the operation time. In another investigation, Tan et al [8] used three heatsinks (21 mm height, with and without fins) filled with n-eicosane and tested those under different usage loads. They found that it is reasonable to use PCM to reduce the rate of temperature increase in a mobile device during the transient heating phase.…”
Section: Introductionmentioning
confidence: 99%
“…They reported that the PCM can stabilize the temperature of the system and extend the operation time. In another investigation, Tan et al [8] used three heatsinks (21 mm height, with and without fins) filled with n-eicosane and tested those under different usage loads. They found that it is reasonable to use PCM to reduce the rate of temperature increase in a mobile device during the transient heating phase.…”
Section: Introductionmentioning
confidence: 99%