Thermal performance of flip chip using finite element method

Yasir, Ahmad; Pereira, D.M.; Hassan, Ahmad; Seetharamu, K.N.

doi:10.1109/itherm.1998.689515

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208)

DOI: 10.1109/itherm.1998.689515

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Thermal performance of flip chip using finite element method

Ahmad Yasir¹,

D.M. Pereira²,

Ahmad Hassan³

et al.

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Thermal performance of flip chip using finite element method

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