2008
DOI: 10.1016/j.enconman.2007.10.024
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Thermal performance of flat vapor chamber heat spreader

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Cited by 84 publications
(24 citation statements)
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“…Xie et al [2] investigated on the cooling high flux chip with a high-performance integrated heat pipeheat sink. Hsieh et al [3] studied on the thermal performance of a flat vapor chamber with spreader. Chang et al [4] investigated the effects of the evaporation surfaces, fill ratios of working fluid and input heating powers on the thermal performance of the heat pipe for electronic equipment cooling.…”
Section: Introductionmentioning
confidence: 99%
“…Xie et al [2] investigated on the cooling high flux chip with a high-performance integrated heat pipeheat sink. Hsieh et al [3] studied on the thermal performance of a flat vapor chamber with spreader. Chang et al [4] investigated the effects of the evaporation surfaces, fill ratios of working fluid and input heating powers on the thermal performance of the heat pipe for electronic equipment cooling.…”
Section: Introductionmentioning
confidence: 99%
“…The surface temperature distribution of the vapor chamber was more uniform than the metal plate and less sensitive to the heat source size and the input power. Hsieh et al [4,5] presented analytical and experimental results concerning the thermal performance of a vapor chamber. They concluded that a vapor chamber without a pillar outperformed one with a pillar, and that the vapor chamber is a favorable alternative to the traditional solid metal heat sink.…”
Section: Introductionmentioning
confidence: 99%
“…Xie et al [3] experimentally investigated on a novel high-performance integrated heat pipe-heat sink for high-flux chip cooling. Hsieh et al [4] examined the spreading thermal resistance of a flat vapor chamber. Vin and Astrain [5] studied on the development of a thermoelectric refrigerator with two-phase thermosyphons.…”
Section: Introductionmentioning
confidence: 99%