Atomic-order nitridation of Si(100) in an NH3 environment (124-1400 Pa) at 300-650°C has been investigated using an ultraclean low pressure hot-wall reactor system. At 500°C or higher, the N atom concentration (nN) initially increases and tends to saturate to a certain value (d 5 A, N -ABSTRACT Soft baking, one of the key steps in photoresist processing, is modeled theoretically. The relevant mechanisms involved in this step and the relative significance of each mechanism are discussed, and an analytical expression for the temporal variation of film thickness is derived. The applicability of the model derived is justified by fitting the experimental data for JSR 1X150 and Shipley SPR51OLA photoresists reported in the literature. We show that the rate of transfer of solvent is controlled by its convective transport near the film-gas interface.