Thermal modelling of high-frequency magnetic components for power electronics by Finite Element Analysis

Abstract

Volume fraction of conductor material. τ * Introduced variable to replace τ . T cmax Maximum core temperature. T c surf Average core surface temperature. T wmax Maximum winding temperature. T w surf Average winding surface temperature. ∆T Temperature rise. ∆T exp Measured temperature rise. ∆T wireFEA Temperature rise with 'wire level' homogenization. ∆T sim Temperature rise obtained by simulation. ∆T windFEA Temperature rise with 'winding level' homogenization. φ Wire diameter. v cond Volume of conductor material. v ist Volume of strand insulation material. v i imp Volume of impregnation material. v i bund Volume of bundle insulation. v w Volume of a wire. w Width of the cell under study. W a Window area.