J. Electron. Mater.
 2023
DOI: 10.1007/s11664-023-10428-4
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Thermal, Microstructural, and Mechanical Features of Bi-Containing Sn-1Ag-0.5Cu Lead-Free Solders

H. Y. Zahran
1
,
A. F. Abd El‐Rehim
2
,
Ashraf Mahmoud
3
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