Thermal-Mechanical FE Analysis of IGBT Module with Different Power Terminal Shape

Wang, Rui; Yao, Erxian; Liu, Xuguang; Pan, Zhengwei; Changcheng, Dong; Li, WeiBang

doi:10.1109/icept50128.2020.9202631

2020 21st International Conference on Electronic Packaging Technology (ICEPT) 2020

DOI: 10.1109/icept50128.2020.9202631

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Thermal-Mechanical FE Analysis of IGBT Module with Different Power Terminal Shape

Rui Wang¹,

Erxian Yao²,

Xuguang Liu³

et al.

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Thermal-Mechanical FE Analysis of IGBT Module with Different Power Terminal Shape

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