Thermal management strategy for electronic chips based on combination of a flat-plate heat pipe and spray cooling

Research on the Manufacturing Process and Heat Transfer Performance of Ultra-Thin Heat Pipes: A Review

“…The maximum heat transfer rate of the heat pipe was increased by nearly 35.5%, under the condition of horizontal placement, but the optimization effect decreased under the inclined angle [ 97 ]. The optimal design of the heat pipe is more flexible, as shown in the Figure 20 e [ 98 ], so Zhao et al combined the heat pipe and spray cooling technology. Under the spray speed of 1.63 L/min, the thermal resistance of the heat pipe is 0.0469 K/W, and the corresponding effective thermal conductivity is as high as 2371.77 W/(m·K) [ 98 ].…”

“…The optimal design of the heat pipe is more flexible, as shown in the Figure 20 e [ 98 ], so Zhao et al combined the heat pipe and spray cooling technology. Under the spray speed of 1.63 L/min, the thermal resistance of the heat pipe is 0.0469 K/W, and the corresponding effective thermal conductivity is as high as 2371.77 W/(m·K) [ 98 ]. The heat transfer performance of spray cooling technology is much higher than that of air-cooled radiators and water-cooled radiators [ 98 ].…”

“…Under the spray speed of 1.63 L/min, the thermal resistance of the heat pipe is 0.0469 K/W, and the corresponding effective thermal conductivity is as high as 2371.77 W/(m·K) [ 98 ]. The heat transfer performance of spray cooling technology is much higher than that of air-cooled radiators and water-cooled radiators [ 98 ].…”

“… Different optimized designs: ( a ) schematic diagram of the spiral coil heat pipe structure and its application design [ 93 ]; ( b ) the relationship between heat flux, optimal wick permeability and effective thermal conductivity, heat flux, optimal wick thickness, as well as the relationship between the relevant pressure drop, heat flux, ratio of optimal evaporator length to condenser length ( Le/Lc ), and optimal wick permeability ( K ) and wick thickness ( t wick ) [ 94 ]; ( c ) the effect of the number of layers of wire mesh on the heat transfer rate of the heat pipe in the horizontal direction [ 95 ]; ( d ) The operation diagram of the heat pipe with auxiliary pipes, the thermal resistance comparison of standard heat pipe, NOM, and BOM, where R HP is heat pipe thermal resistance, R Sys is system thermal resistance [ 96 ]; ( e ) schematic diagram of the combination of heat pipe and spray cooling [ 98 ]. …”

Parametrical Study on the Capillary Flowing Characteristics of the Parallel Microchannel Array

“…Therefore, improvements in heat dissipation technology (miniaturization and high heat dissipation performance) for electronic products are required. Heat sink cooling solutions of microchannels on the microscale have attracted extensive attention [2][3][4]. The silicon-based microchannel heat dissipation unit has become an up-and-coming chip cooling solution for microelectronic devices, characterized by a flexible layout, a good heat transfer behavior, and mass production [5][6][7], which can be directly integrated and packaged with the chip.…”