Thermal Management of Multi Core Processor Using U Configured Parallel Microchannel Cooling System

Abstract

Thriving technologies in the electronics industry demands effective cooling systems for proper thermal management of the devices. To propose an effective cooling system, real-time challenges need to be taken into examination. One of the challenges is the non-uniform heat load emitted by the device. In this paper, a multicore processor has mimicked for the heat load and examined with U configured parallel microchannel cooling system (PMCS) for its capacity to cool the processor effectively. A detailed numerical examination has been conceded out by mimicking the AMD Ryzen-7 octa-core processor for its size, shape and heat load. To make it convenient for applying non-uniform heat load, the shape of the PMCS is divided into 4*4 array of a total of 16 heaters. The present has witnessed that, there is an uneven distribution of fluid flow across the channels. The initial channels do get more quantity of fluid whereas the end channels do get a very less quantity of fluid. Why because of the flow maldistribution, it formed the hot spots (high-temperature zones), which will be further intensified due to the non-uniform heat load emitted by the processor. It perceived from the present numerical analysis, there is a formation of hotspots not only due to the random location of active cores but also due to the flow maldistribution across the channels. The flow arrangement of U configuration having worse flow distribution among other existing configuration. The present work conclusively demonstrates that high maldistribution leads towards dropping the uniformity of cooling. But the existing maldistribution can be effectively exploited to tackle the non-uniform heat load released by the processor when the active core location falls in the place of initial channels.