2020
DOI: 10.1016/j.ijheatmasstransfer.2019.119199
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Thermal management of electronic devices using pin-fin based cascade microencapsulated PCM/expanded graphite composite

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Cited by 143 publications
(35 citation statements)
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“…Subsequently, the normalized matrix is obtained and it is shown in Table 10. Next, the weighted normalized matrix is determined by following Equation (12). The positive ideal solutions and negative ideal solutions are obtained by using the Equations (13) and (14).…”
Section: The Topsis Methodsmentioning
confidence: 99%
See 3 more Smart Citations
“…Subsequently, the normalized matrix is obtained and it is shown in Table 10. Next, the weighted normalized matrix is determined by following Equation (12). The positive ideal solutions and negative ideal solutions are obtained by using the Equations (13) and (14).…”
Section: The Topsis Methodsmentioning
confidence: 99%
“…Numerous studies [4][5][6][7][8][9][10][11][12][13] have been carried out to examine the application of PCM in thermal management of electronic components. PCM can store a large amount of heat during phase change at a nearly constant temperature, which enables the efficient thermal management of electronic devices.…”
Section: Introductionmentioning
confidence: 99%
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“…Ren et al [15] numerically investigated the impacts of the pin-fin configuration, expanded graphite (EG) content, PCM melting temperature, and heating conditions on the thermal performance of the MEPCM-EG composite with pin-fins using the three-dimensional (3D) lattice Boltzmann method. The results showed that a pin-fin array with medium fin number and fin thickness helps balance the increased heat transfer capability and the decreased latent heat of the MEPCM to achieve the optimum thermal performance.…”
Section: Introductionmentioning
confidence: 99%