2015
DOI: 10.1016/j.ijthermalsci.2014.10.012
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Thermal management of electronic devices using carbon foam and PCM/nano-composite

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Cited by 141 publications
(35 citation statements)
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“…Heat transfer surface area is limited in miniature designs, therefore, they cannot be cooled down with natural or forced convection when working fluid is air. Therefore, the current literature focuses on heat transfer enhancement with phase changing materials or forced convection with water, oil or nano-fluids working fluids [3][4][5][6][7][8][9][10][11][12][13][14]. These methods are essential in order to increase the rate of heat transfer.…”
Section: Introductionmentioning
confidence: 99%
“…Heat transfer surface area is limited in miniature designs, therefore, they cannot be cooled down with natural or forced convection when working fluid is air. Therefore, the current literature focuses on heat transfer enhancement with phase changing materials or forced convection with water, oil or nano-fluids working fluids [3][4][5][6][7][8][9][10][11][12][13][14]. These methods are essential in order to increase the rate of heat transfer.…”
Section: Introductionmentioning
confidence: 99%
“…HR-TEM was equipped with selected-area electron diffraction (SAED). The crystalline phase identification of the samples was carried out by X-ray diffraction (XRD, X'pert 3 Powder, PANalytical Co., Almelo, The Netherlands). The diffraction data were collected in the range of 30-80 • with a scan speed of 2 • /s using Cu-Kα radiation (wavelength = 1.54056 Å).…”
Section: Characterizationmentioning
confidence: 99%
“…In order to avoid the malfunction of electronic devices, composites materials used in these devices should have high thermal conductivity and electrical insulator properties. Normally, high thermal conductive performance has been obtained by adding fillers due to the thermal conductive chains or networks produced by the fillers [1][2][3][4][5]. In order to improve the thermal conductivity of composites, various inorganic ceramic fillers with high thermal conductivity have been introduced into insulation composites; notable example include silicon nitride (SiN) [6][7][8], silicon carbide (SiC) [9], boron nitride (BN) [10,11], alumina oxide (Al 2 O 3 ) [12][13][14], and alumina nitride (AlN) [15][16][17].…”
Section: Introductionmentioning
confidence: 99%
“…The heat transfer surface area cannot be increased in miniature designs. Therefore, the current literature focuses on heat transfer enhancement with nanofluids and phase change [1][2][3][4]. These methods are essential in order to increase the heat transfer.…”
Section: Introductionmentioning
confidence: 99%