Thermal Management of Concentrated Multi-Junction Solar Cells with Graphene-Enhanced Thermal Interface Materials

Saadah, Mohammed Ahmed; Hernandez, E.; Balandin, Alexander A.

doi:10.3390/app7060589

Cited by 56 publications

(30 citation statements)

References 63 publications

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“…GnPs have been incorporated into a conventional thermal interface material to improve the heat dissipation of a photovoltaic solar cell . During the operation of a photovoltaic solar cell, significant temperature rise is induced by the concentration of solar light into a small area, increase of energy absorption, and layered structure of the multijunction cells.…”

Section: Polymer/graphene Compositesmentioning

confidence: 99%

“…The thermal conductivity increment from ≈0.5 to 1.2 W m −1 K −1 was explained by (i) very high intrinsic thermal conductivity of graphene and the stable coupling to the grease matrix and (ii) thermal transfer network of GnPs with other particles in the composite. The composite was found to reduce the degradation of open‐circuit voltage from ≈34% to 12% …”

Section: Polymer/graphene Compositesmentioning

confidence: 99%

See 1 more Smart Citation

Graphene Platelets and Their Polymer Composites: Fabrication, Structure, Properties, and Applications

Shi

Araby

Gibson

et al. 2018

Adv Funct Materials

187

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Graphene oxide is extensively compounded with polymers toward a wide variety of applications. Less studied are few-layer or multi-layer highly crystalline graphene, both of which are herein named as graphene platelets. This article aims to provide the most recent advancements of graphene platelets and their polymer composites. A first focus lies on cost-effective fabrication strategies of graphene platelets -intercalation and exfoliation -which work in a relative mass scale, e.g., 5.3 g h −1 . As no heavy oxidization is involved, the platelets have high crystalline integrity, e.g., C:O ratio over 8.0, with thicknesses 2-4 nm and lateral dimension up to a few micrometers. Through carefully selecting the solvent for dispersion and the molecules for surface modification, graphene platelets can be liquid-processable, enabling them to be printed, coated, or compounded with various polymers. A purposedesigned experiment is undertaken to unravel the effect of reasonable ultrasonication time on the platelet thickness. Typical polymer/graphene platelet composites are critically examined for their preparation, structure, and applications such as thermal management and flexible/stretchable electronic devices. Perspectives on the limitations, current challenges, and future prospects for graphene platelets and their polymer composites are provided.

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Section: Polymer/graphene Compositesmentioning

confidence: 99%

Section: Polymer/graphene Compositesmentioning

confidence: 99%

Graphene Platelets and Their Polymer Composites: Fabrication, Structure, Properties, and Applications

Shi

Araby

Gibson

et al. 2018

Adv Funct Materials

187

View full text Add to dashboard Cite

show abstract

“…[1][2][3] The development of the next generation of thermal interface materials (TIMs) with substantially higher thermal conductivity is essential for various device technologies. The state-of-the-art light emitting diodes, [4] lithium-ion batteries, [5,6] and solar cells [7] suffer from the inadequate heat Graphene has attracted a lot of attention owing to its extraordinary electrical, [11,12] optical, [13] and thermal properties. [1,[14][15][16][17][18][19][20] The intrinsic thermal conductivity of a large sheet of single-layer graphene (SLG) can exceed than that of the basal planes of high-quality graphite, which by itself is high: ≈2000 Wm −1 K −1 at RT.…”

Section: Introductionmentioning

confidence: 99%

“…It is known that FLG can be mass produced at low cost, which is an important factor for any fillers in TIMs, composites, and coatings. [2,5,7,10,20,[24][25][26][27][28] The sheets of FLG are also less vulnerable to defects induced by processing, mechanical stresses, rolling, and folding, which happens often during the mixing of fillers with the polymer matrix. [10,20,24] The first study of graphene composites reported an enhancement of the thermal conductivity of epoxy from 0.2 to ≈ 5 Wm −1 K −1 at the low graphene loading of ≈ 10 vol%.…”

Section: Introductionmentioning

confidence: 99%

Thermal Properties of the Binary‐Filler Hybrid Composites with Graphene and Copper Nanoparticles

Barani

Mohammadzadeh

Geremew

et al. 2019

Adv Funct Materials

197

148

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The thermal properties of epoxy‐based binary composites comprised of graphene and copper nanoparticles are reported. It is found that the “synergistic” filler effect, revealed as a strong enhancement of the thermal conductivity of composites with the size‐dissimilar fillers, has a well‐defined filler loading threshold. The thermal conductivity of composites with a moderate graphene concentration of fg = 15 wt% exhibits an abrupt increase as the loading of copper nanoparticles approaches fCu ≈ 40 wt%, followed by saturation. The effect is attributed to intercalation of spherical copper nanoparticles between the large graphene flakes, resulting in formation of the highly thermally conductive percolation network. In contrast, in composites with a high graphene concentration, fg = 40 wt%, the thermal conductivity increases linearly with addition of copper nanoparticles. A thermal conductivity of 13.5 ± 1.6 Wm−1K−1 is achieved in composites with binary fillers of fg = 40 wt% and fCu = 35 wt%. It has also been demonstrated that the thermal percolation can occur prior to electrical percolation even in composites with electrically conductive fillers. The obtained results shed light on the interaction between graphene fillers and copper nanoparticles in the composites and demonstrate potential of such hybrid epoxy composites for practical applications in thermal interface materials and adhesives.

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“…[61][62][63] This is required for the fillers used in EMI shielding materials. [68,[70][71][72][73][74][75][76] The first studies showed that adding even a small loading fraction of the optimized mixture of graphene and FLG (up to f = 10 vol%) to the pristine epoxy increases its thermal conductivity by a factor of ×25. The reported values of the "intrinsic" thermal conductivity of highquality large graphene layers are in the range from 2000 to 5000 W m −1 K −1 near room temperature (RT).…”

Section: Introductionmentioning

confidence: 99%

Dual‐Functional Graphene Composites for Electromagnetic Shielding and Thermal Management

Kargar

Barani

Balinskiy

et al. 2018

Adv Elect Materials

191

132

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and environment. [12][13][14] The current industrial and safety standards require blocking of more than 99% of the EM radiation from any electronic devices. [1,[15][16][17] From the other side, the operation of the electronic devices can be disrupted by the outside EM waves. The heat and EM radiation have an inherent connection-absorption of EM waves by any material results in its heating. The energy from EM wave transfers to electrons and then to phonons-quanta of crystal lattice vibrations. The conventional approach for handling the heat and EM radiation problems is based on utilization of the thermal interface materials (TIM), which can spread the heat, and electromagnetic interference (EMI) shielding materials, which can protect from EM waves. These two types of materials have different, and, often, opposite characteristics, e.g., excellent EMI material can be a poor heat conductor, while efficient TIM can utilize electrically nonconductive fillers, resulting in its transparency for EM waves. Here, we propose a concept of the "dual-functional" EMI shielding-TIM materials, and demonstrate it on the example of graphene composites.It is well known that EMI shielding requires interaction of the EM waves with the charge carriers inside the material so that EM radiation is reflected or absorbed. For this reason, the EMI shielding material must be electrically conductive or contain electrically conductive fillers, although a high electrical conductivity is not required. The bulk electrical resistivity on the order of 1 Ω cm is sufficient for most of EMI shielding applications. [1,3,15] Most of the polymer-based materials widely used as TIMs in electronic packaging are electrically insulating and, therefore, transmit EM waves. Conventionally, metal particles are added as fillers in high volume fractions to the base polymer matrix in order to increase the electrical conductivity and prevent EM wave propagation from the device to the environment and vice versa. [1,[18][19][20][21] However, the polymer-metal composites suffer from high weight, cost, and corrosion, which make them an undesirable choice for the state-of-the-art downscaled electronics. Several studies reported the use of carbon fibers, [22][23][24][25][26][27][28][29] carbon black, [30,31] bulk graphite, [32][33][34] carbon nanotubes (CNT), [16,17,[35][36][37][38][39] reduced graphene oxide (rGO), [2,6,[40][41][42][43][44][45][46][47][48][49][50] graphene, [51][52][53][54] and combination of carbon allotropes with orThe synthesis and characterization of epoxy-based composites with few-layer graphene fillers, which are capable of dual-functional applications, are reported. It is found that composites with certain types of few-layer graphene fillers reveal an efficient total electromagnetic interference shielding, SE tot ≈ 45 dB, in the important X-band frequency range, f = 8.2 −12.4 GHz, while simultaneously providing high thermal conductivity, K ≈ 8 W m −1 K −1 , which is a factor of ×35 larger than that of the base matrix material. The efficiency of the d...

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Thermal Management of Concentrated Multi-Junction Solar Cells with Graphene-Enhanced Thermal Interface Materials

Cited by 56 publications

References 63 publications

Graphene Platelets and Their Polymer Composites: Fabrication, Structure, Properties, and Applications

Graphene Platelets and Their Polymer Composites: Fabrication, Structure, Properties, and Applications

Thermal Properties of the Binary‐Filler Hybrid Composites with Graphene and Copper Nanoparticles

Dual‐Functional Graphene Composites for Electromagnetic Shielding and Thermal Management

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