2015
DOI: 10.1016/j.applthermaleng.2015.07.027
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Thermal management for a micro semiconductor laser based on thermoelectric cooling

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Cited by 44 publications
(15 citation statements)
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“…From the temperature rising simulation results in Figure 9, we approximately calculated the TEC performance parameters, Rm, Km and Sm, for Th = 50°C and the following parameters were obtained: Rm = 0.985Ω, Km = 0.946K/W and Sm = 0.048V/K. Using Equation equation (11), in the first situation,Ta = 298.15K (25°C ), the TEC drive current (I) was defined as 5A, and it was assumed that R1 = R2 = 0.1K/W and T1 = 293.15K (20°C ) at which the pump source can work stably. For the two groups of TEMs with R3 = 0.04K/W, the cooling output of each TEM was Qc1 = 39.5W, and for the other two groups of TEMs with R3 = 0.03K/W, the cooling output of each TEM was Qc2 = 40W.…”
Section: Experiments Results and Discussionmentioning
confidence: 99%
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“…From the temperature rising simulation results in Figure 9, we approximately calculated the TEC performance parameters, Rm, Km and Sm, for Th = 50°C and the following parameters were obtained: Rm = 0.985Ω, Km = 0.946K/W and Sm = 0.048V/K. Using Equation equation (11), in the first situation,Ta = 298.15K (25°C ), the TEC drive current (I) was defined as 5A, and it was assumed that R1 = R2 = 0.1K/W and T1 = 293.15K (20°C ) at which the pump source can work stably. For the two groups of TEMs with R3 = 0.04K/W, the cooling output of each TEM was Qc1 = 39.5W, and for the other two groups of TEMs with R3 = 0.03K/W, the cooling output of each TEM was Qc2 = 40W.…”
Section: Experiments Results and Discussionmentioning
confidence: 99%
“…However, it requires the connection of an external water cooler which causes the laser to have a large. Forced air cooling, heat pipe cooling, micro-channel cooling and other passive cooling methods can only ensure the temperature of the laser is higher than the ambient environment [11], while in some situations, the temperature of the laser needs to be controlled to be lower than the environment. Thermoelectric cooling, usually considered using the thermoelectric cooler (TEC), has advantages over conventional cooling devices, including being compact in size, having high reliability, no mechanical moving parts, no working liquid, light in weight, being powered by direct current, and easily switching between cooling and heating modes [12].…”
Section: Introductionmentioning
confidence: 99%
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“…[10][11][12] Compared with conventional thermoelectric materials, many novel thermoelectric mechanisms and technologies such as superlattices and quantum dots have been investigated recently.…”
mentioning
confidence: 99%