Thermal Management and Communication Virtualization for Reliability Optimization in MPSoCs

Abstract

This chapter covers the interdependencies of temperature and the reliable operation of multiprocessor systems on chip (MPSoC). Starting with the assessment of temperature values for the different cores either through measurement or estimation, it is shown which methods on system level can be applied to balance the thermal stress in the system and thus to come to an evenly distributed probability of errors. Special focus is given to task migration as a system-level means, which is supported by an on-chip interconnect virtualization technique that eases fast and transparent switch-over of communication channels. Overall, it is shown how mechanisms on different levels of the system stack can be combined to cooperate across layers for improving system reliability.