Thermal Interface Materials with High Adhesion and Enhanced Thermal Conductivity Via Optimization of Polymer Networks and Filler

Xie, Xiangchao; Pang, Yunsong; Rao, Shipeng; Zeng, Chen; Zhang, Chenxu; Guo, Shifeng; Xu, Jianbin; Zeng, Xiaoliang; Sun, Rong

doi:10.2139/ssrn.4822851

2024

DOI: 10.2139/ssrn.4822851

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Thermal Interface Materials with High Adhesion and Enhanced Thermal Conductivity Via Optimization of Polymer Networks and Filler

Xiangchao Xie,

Yunsong Pang,

Shipeng Rao

et al.

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Thermal Interface Materials with High Adhesion and Enhanced Thermal Conductivity Via Optimization of Polymer Networks and Filler

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