solve scaling down difficulties. As one of the most fundamental components in IC, particularly for artificial intelligence (AI) circuits, new memory designs have emerged. [1][2][3][4][5][6][7][8][9] Some of them are based on the mechanism of charge storage into the junction. [10] Therefore, numerous memory designs have been proposed to replace dynamic random access memory (DRAM) [3,5] or Flash. [10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25] While the programming time of Flash is on the order of 10 µs and the retention time is long, the programming time of DRAM is on the order of 10 ns and the retention time is as short as 64 ms. Updated memory designs are needed to combine the advantages of fast programming time and long enough retention time, i.e., the advantages of both DRAM and Flash. Meanwhile, memristors have attracted much attention due to their applications, such as multilevel applications. [4] However, they are all complex and require high technology different from the dominant silicon-based technology. For instance, a transistor with a semi-floating gate requires 2D materials and additional steps for a semi-floating gate. [6] Electrical properties of a memristor are mainly controlled by 2 terminal technology, which is more difficult to control than those of the transistor with mature 3 or 4 terminal technology and high reliability. [4] Hence, their applications in real life are still very far due to the difficulties to match foundry lines. We have proposed a simpler memory transistor with simpler processing steps. [9] Here, a memory transistor based on modern 130 nm silicon-on-insulator (SOI) technology is proposed, with the advantages of both fast programming times comparable to DRAM and much longer retention times. By using one transistor to replace the DRAM which has one transistor and one capacitor, the new memory has a smaller area and a simpler fabrication. Based on a junction for charge storage, [9] this memory is implemented with 130 nm technology, which is a promising alternative candidate of DRAM for information technology applications. IC, especially AI could be further developed, as well as the artificial synaptic devices for medical caring, with such memory structures.As shown in Figure 1, the updated memory structure could be similar to a transistor. Here, the sample preparation process is as follows. The transistor has a p-type Si doping on A more compact integrated-circuit (IC) design is proposed to solve the difficulties experienced when conventional scale-down methods for IC approache the physical limits of the device. Memory is a key component in ICs, particularly in artificial intelligence (AI) circuits. However, current cutting-edge designs are not suitable for mass production. Here, a onetransistor memory with additional electrode(s) directly connected to the channel is proposed as a memory and artificial synaptic device, meaning it can also be used to implement logic gates. The memory proves to be suitable for multilevel memory applications, and had a high current...