Thermal imidization optimization of polyimide thin films using Fourier transform infrared spectroscopy and electrical measurements

Diaham, Sombel; Locatelli, Marie-Laure; Lebey, Thierry; Malec, David

doi:10.1016/j.tsf.2010.10.031

Cited by 74 publications

(41 citation statements)

References 27 publications

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“…Indeed, dielectric characterizations can be more sensitive than infrared measurements regarding the determination of the imidization temperature optimum. In the section 2, the results are extracted from [24].…”

Section: Synthesis and Optimization Of The Imidization Of Bpda-pda Pomentioning

confidence: 99%

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BPDA-PDA Polyimide: Synthesis, Characterizations, Aging and Semiconductor Device Passivation

Diaham¹,

Locatelli²,

Khazaka³

2012

High Performance Polymers - Polyimides Based - From Chemistry to Applications

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Section: Synthesis and Optimization Of The Imidization Of Bpda-pda Pomentioning

confidence: 99%

“…This is in likelihood agreement with the evolution of the COOband intensity which reaches its lowest magnitude at 400 °C before it increases again Measurements performed at room temperature. Taken from [24].…”

Section: Electrical Propertiesmentioning

confidence: 99%

BPDA-PDA Polyimide: Synthesis, Characterizations, Aging and Semiconductor Device Passivation

Diaham¹,

Locatelli²,

Khazaka³

2012

High Performance Polymers - Polyimides Based - From Chemistry to Applications

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“…Sample preparation and electrical measurements PI thin films have been synthesized from biphenyltetracarboxilic dianhydride (BPDA) and p-phenylene diamine (PDA) and spin-coated on stainless steel substrates before a curing at 400 °C for 1 hour in N 2 [6]. A film thickness of 1.4 μm was obtained.…”

Section: Experiments and Modelmentioning

confidence: 99%

“…the degradation temperature of BPDA/PDA PI films [6]). In a first approach, we have only considered in the present study the thermal-activated current form as the input term:…”

Section: B Thermal Breakdown Modelmentioning

confidence: 99%

Thermal breakdown modeling in polyimide films by solving the heat balance equation

Diaham

Mary

Malec

et al. 2013

2013 Annual Report Conference on Electrical Insulation and Dielectric Phenomena

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The theoretical thermal breakdown in polyimide (PI) films was modeled at very high temperature between 320 °C and 400 °C using the heat balance equation. Its value was extracted from the internal temperature rise versus electric field of the sample up to its thermal degradation. The originality of this study appears in the consideration, for the first time, of the real temperature dependence of the heat capacity C v (T), compared to others studies where C v is fixed at a constant value. It has been possible by measuring it by DSC in a large temperature range up to 390 °C and by interpolating higher values using polynomial fitting. Moreover, the thermal conductivity has also been measured at room temperature only but its value was assumed to be constant and remaining low like in most of polymers. As an input, a simple thermal-activated current density has been used to solve the heat balance equation in a first approach. The results show that the use as an input of a constant value of the capacity C v (T 0 ), where T 0 is the sample temperature, leads to large difference between both calculated and measured breakdown fields. In comparison, the implementation of the temperature dependence C v (T) during the solving of the model leads to closer quantitative results. Some future ways of enhancement of the model are proposed.

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“…19 A film thickness of 5.38 lm 6 0.001 lm, measured by mechanical profilometry, was obtained. Capacitor structures were achieved by evaporating in vacuum (10 À4 Pa) circular gold electrodes of 2 mm in diameter and 150 nm in thickness on the PI surface.…”

mentioning

confidence: 99%

Thermal runaway in polyimide at high electric field probed by infrared thermography

Diaham

Belijar

Locatelli

et al. 2015

Applied Physics Letters

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An original way for characterizing dielectrics under high electric field and high temperature based on the coupling between electric current measurements and real-time fast infrared (IR) thermography is demonstrated. Particularly, the Joule heating phenomenon at high field is quantified by 2D-temperature cartography in a polyimide (PI) film set at an initial temperature of 300 °C through IR observations of the polarized electrode. 2D-temperature cartography highlights the temperature increase with increasing the electric field. The thermal runway occurs prior to the dielectric breakdown from an electric field threshold of 140–150 V/μm. This corresponds to a dissipated volume power density between 2 and 5 mW/μm3. Such values report the limit of the electro-thermal equilibrium in PI film.

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Thermal imidization optimization of polyimide thin films using Fourier transform infrared spectroscopy and electrical measurements

Cited by 74 publications

References 27 publications

BPDA-PDA Polyimide: Synthesis, Characterizations, Aging and Semiconductor Device Passivation

BPDA-PDA Polyimide: Synthesis, Characterizations, Aging and Semiconductor Device Passivation

Thermal breakdown modeling in polyimide films by solving the heat balance equation

Thermal runaway in polyimide at high electric field probed by infrared thermography

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