Thermal Imaging Microscope and Applications

Kim, D.U.; Jeong, Chan Bae; Choi, Won-Il; Ryu, Seon Young; Chang, Kunok

doi:10.21611/qirt.2017.022

Cited by 1 publication

(1 citation statement)

References 7 publications

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“…Therefore, exothermic problems are becoming increasingly critical. 1,2) Accordingly, electronic equipment must have consistently high heat resistance and heat dissipation characteristics in its solder joints to ensure reliability. In the 1990s, Sn-Pb eutectic solder was used to solder electronic components based on its low melting point (183 °C), excellent joint reliability, and low cost.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of the thermal effusivity of intermetallic compounds using a modulated thermoreflectance method

Nakamura

Murakami

Miyake

2022

Jpn. J. Appl. Phys.

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In this study, we implemented the thermoreflectance method with a high spatial resolution by focusing a laser beam to evaluate the thermal properties of solder joints with a focus on the frequency-dependent thermal diffusion length. The same intermetallic compounds (IMCs) in solder joints were measured at multiple frequencies of thermal effusivity using calibration curves generated from standard samples with known thermal properties. The converted heat effusivity rate was 5000 to 7000 Js−0.5m−2K−1. By comparing the results of the measurements to those of the solder, it was determined that the composition of solder affects the thermophysical properties of the IMCs formed at the interface between solder and copper. Numerical calculations were conducted to determine the apparent thermal conductivity of a Mo film and the volumetric heat capacity of a solder joint was determined to calculate the thermal conductivity. The apparent thermal conductivity of the Mo film was 0.5 Wm−1K−1 and the thermal conductivity of the solder joint was 25 to 37 Wm−1K−1.

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Section: Introductionmentioning

confidence: 99%