2019
DOI: 10.1364/ao.58.001966
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Thermal hydraulic performance of a microchannel heat sink for cooling a high-power diode laser bar

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Cited by 6 publications
(1 citation statement)
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“…Common packaging forms used for bars are solid conduction cooling (CS) packages for passive heat dissipation and circulating liquid micro-channel cooling (MCC) packages for active heat dissipation [11]. The MCC package has better heat dissipation capability and is commonly used in single-bar packages [12,13]. Therefore, this paper focuses on the thermal characteristics of the MCC package for the bar.…”
Section: Introductionmentioning
confidence: 99%
“…Common packaging forms used for bars are solid conduction cooling (CS) packages for passive heat dissipation and circulating liquid micro-channel cooling (MCC) packages for active heat dissipation [11]. The MCC package has better heat dissipation capability and is commonly used in single-bar packages [12,13]. Therefore, this paper focuses on the thermal characteristics of the MCC package for the bar.…”
Section: Introductionmentioning
confidence: 99%