2016
DOI: 10.1016/j.solmat.2016.05.051
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Thermal History Index as a bulk quality indicator for Czochralski solar wafers

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Cited by 6 publications
(6 citation statements)
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“…[ O i ] at the selected positions was measured using OxyMap on as‐cut wafers and FTIR measurements on thick double‐side polished slices. Both techniques gave virtually identical results within a few percents.…”
Section: Methodsmentioning
confidence: 99%
“…[ O i ] at the selected positions was measured using OxyMap on as‐cut wafers and FTIR measurements on thick double‐side polished slices. Both techniques gave virtually identical results within a few percents.…”
Section: Methodsmentioning
confidence: 99%
“…Crystalline silicon material selection is crucial for SHJ manufacturing in order to limit production costs and assure high efficiencies. As this c-Si technology is all processed at low temperature (T<230°C), it is not possible to remove bulk c-Si impurities as performed for conventional homo-junction technologies using as-called "gettering" and cleaning [9][10]. For this reason, high quality Czochralski (Cz) wafers are used as substrates, which account for about 70 % of the cell production material costs.…”
Section: Materials Selection and Pre-productionmentioning
confidence: 99%
“…Detailed studies have been performed at CEA-INES pilot line to evaluate the impact of wafers properties on cell efficiencies and its parameters. Evaluations at the full ingot scale, for several suppliers has been performed showing that high oxygen content can lead to efficiency limitation in Cz ingot seed-end while metallic impurities may affect cells made with ingot tail-end wafers [10][11].…”
Section: Materials Selection and Pre-productionmentioning
confidence: 99%
“…O XIDE precipitates (OPs) are common defects in the Czochralski (Cz) silicon and can cause severe efficiency degradation in solar cells produced from crystal regions with a high oxygen concentration [1]- [3]. During the solar cell production, oxygen precipitation is facilitated by the combination of the cooldown after crystallization during which nuclei form, the dopant source deposition at around 800°C (POCl 3 ) or 900-950°C (BBr 3 ), which leads to precipitate sizes sufficiently large to survive a following high-temperature step at which the precipitates grow sufficient enough to limit the charge carrier lifetime.…”
Section: Introductionmentioning
confidence: 99%