Thermal fatigue analysis of gold wire bonding solder joints in MEMS pressure sensors by thermal cycling tests

Zhang, Yunfan; Wu, Kangkang; Li, Hui; Shen, Shengnan; Cao, Wan; Li, Feng; Han, Jinzhe

doi:10.1016/j.microrel.2022.114829

Cited by 14 publications

(4 citation statements)

References 12 publications

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“…It is necessary to evaluate the fatigue life of the wire bonding of functional sensor. Our previous work investigated the thermal fatigue failure of Au wire bonding in MEMS pressure sensor by resistance measurement and CT scanning [23]. The results showed that the solder joint cracked or even separated from the pad, which agreed with the greatly increasing of resistance.…”

Section: Introductionmentioning

confidence: 61%

Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors

Zhang

Shen

et al. 2022

J. Micromech. Microeng.

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The failure of the gold wire bonding solder joint of a MEMS pressure sensor caused by the thermal cycling test was investigated with thermal cycling experiments and fatigue simulations. The results show that the maximum stress and strain occurred at the root of the solder joint on the substrate. With the accumulation of strain caused by thermal cycles, the bonding area of solder joint became smaller and the shear force of solder joints reduced to 22.3% after 1600 thermal cycles. The solder joints on the substrate failed after 1940 thermal cycles in plastic fatigue simulations and 3.16×108 thermal cycles in creep fatigue simulations. Plastic fatigue is the major factor for thermal failure of gold wire bonding.

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Section: Introductionmentioning

confidence: 61%

Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors

Zhang

Shen

et al. 2022

J. Micromech. Microeng.

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“…Fatigue in MEMS devices could arise due to the fluctuation in applied stress or strain [15], as well as due to temperature variation [16,17], and chemically aggressive or embrittling environment [18] which can create or accelerate crack growth.…”

Section: Siliconmentioning

confidence: 99%

“…The mixedmode SIFs K I,max and K II,max are computed in Ansys from the interaction energy integral using the built-in CINT command and the crack propagation direction (θ c ) is determined from equation (25). Then, the equivalent SIF range (∆K eqv ) is computed according to equations ( 16) and (17), and the number of cycles (∆N) required for the crack to grow by ∆a is obtained from equation (23).…”

Section: Fracture Fem Model Of Central Notched Specimen Modelmentioning

confidence: 99%

Fatigue fracture mechanics in gold-based MEMS notched specimens: experimental and numerical study

Pistorio

Somà

2023

J. Micromech. Microeng.

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The characterization of fatigue fracture mechanics in gold-MEMS notched specimens is presented in this work. A test microstructure with a central notched specimen is specifically designed and built to perform on-chip fatigue test. The central specimen undergoes cyclic loading due to the application of alternating voltage. The variation in the microstructure deflection is measured using an optical profilometer and is attributed to the crack growth in the gold material, causing the variation in the specimen stiffness. The occurrence of pull-in condition is used as a fracture detector, then the fracture of the specimen can be recognized without performing scanning electron microscope inspections during the fatigue test. Crack propagation in the test specimen is simulated through a coupled-field electromechanical fracture finite element model and the computed crack path is compared to the results obtained from scanning electron microscope analyses. Finally, Paris' law is applied and the number of cycles to failure is computed by exploiting the results of the fracture model and experimental measurements. Both experimental and numerical results demonstrate that the notch acts as a stress and strain raiser, fostering crack nucleation from the notch root, and that the linear elastic fracture mechanics theory is still valid to describe crack propagation in micro-size samples.

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“…The processor generates a significant amount of heat when operating under high loads. This extreme environment can easily cause solder joint failure [40]. To ensure the functional reliability of PCBs under harsh environmental conditions, thermal shock experiments are designed and studied to explore the failure mechanism of PCB solder joints in harsh environments.…”

Section: Morphology Of Solder Jointsmentioning

confidence: 99%

Failure Analysis of Printed Circuit Board Solder Joint under Thermal Shock

Zhou

Chen

et al. 2023

Coatings

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Investigating the failure mechanism of solder joints under different temperature conditions is significant to ensure the service life of a printed circuit board (PCB). In this research, the stress and strain distribution of a PCB solder joint was evaluated by high- and low-temperature thermal shock tests. The cross-section of the solder joint after thermal shock testing was measured using a 3D stereoscopic microscope and SEM equipped with EDS. The microstructure of the lead-free solder joint and the phase of the intermetallic compound (IMC) layer were studied by XRD. The working state of the PCB solder joint under thermal shock was simulated and analyzed by the finite element method. The results show that thermal shock has a great effect on the reliability of solder joints. The location of the actual crack is consistent with the maximum stress–strain concentration area of the simulated solder joint. The brittle Cu6Sn5 and Cu3Sn phases at the interface accelerate the failure of solder joints. Limiting the growth of Cu6Sn5 and Cu3Sn phases can improve the reliability of solder joints to a certain extent.

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Thermal fatigue analysis of gold wire bonding solder joints in MEMS pressure sensors by thermal cycling tests

Cited by 14 publications

References 12 publications

Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors

Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors

Fatigue fracture mechanics in gold-based MEMS notched specimens: experimental and numerical study

Failure Analysis of Printed Circuit Board Solder Joint under Thermal Shock

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