“…However, the low electrical and thermal conductivity limited the application of PI in aerospace and microelectronics industry [3,4]. Many efforts have been made to overcome this drawback by incorporation of carbon nanofiller into PI matrix, such as carbon black (CB) [5,6], carbon nanofiber (CNF) [7,8], carbon nanotube (CNT) [9,10] or graphene (GP) [11][12][13]. Among these nanoparticles, graphene is the most attractive one in recent years due to the excellent electrical and thermal conductivity, mechanical flexibility, optical transparency [14][15][16].…”