Thermal, electrical and mechanical properties of carbon fiber/copper powder/carbon black reinforced hybrid Polyamide 6,6 composites

Abstract

The development of low electrical and thermal properties of Polyamide (PA), which is used in place of metals in engineering applications, draws attention to the developments in various industrial disciplines. In this study, the effects of metal and carbon based fillers on the properties of Polyamide 6,6 (PA 6,6) were investigated. Especially, copper powder (Cu), carbon black (CB), carbon fiber (CF) and hybrid fillers (Cu/CB/CF) reinforced composites based on PA 6,6 were prepared by twin-screw extruder followed by injection molding. In the microstructure investigation, it was observed that the dispersion properties of used fillers were different in the PA 6,6 matrix. Both electrical and thermal conductivity of the PA 6,6 composites prepared were higher than pure PA 6,6. The highest electrical and thermal conductivity values were obtained as 7.97x10−2 S/cm and 0.73 W/mK for PA 6,6/CB30 and PA 6,6/CF/CB/Cu 10, respectively. The effects of the fillers on melting and crystallization behaviors and mechanical properties that affect the performance of PA 6,6 composites are also discussed. In general, the results showed that the mechanical properties of PA 6,6 composites were improved with the increase in the amount of hybrid filler. The highest tensile and notched Charpy impact strength were obtained as 252 MPa and 8.84 kJ/m2 in PA 6,6 composite with 30% carbon fiber reinforcement by volume. As a result, the tensile properties of PA 6,6 hybrid composite were found to be superior to PA 6,6/CF composite with the same amount of carbon fiber content.

Investigating the mechanical properties and microstructure of the weld joint obtained by laser welding of PA12/CNT nanocomposites

“…Parameswaranpillai et al [ 43 ] have also found that the IS of PP/PS composite slightly reduced with the addition of CNTs, because CNTs cannot transfer stresses between PS dispersed phase and PP matrix. In another research, Beyaz et al [ 44 ] observed that the IS of PA 6.6/Cu composites decreased as the amount of copper powder increased, because a weak interaction was formed between the matrix and the filling material.…”

Performance investigation of hydrothermally stressed polyamide nanocomposites for insulation applications

“…In another study characteristic investigation of graphene nanoplates (GNP) filled polyamide nanocomposites is reported. The reduction in tan delta and increment in thermal stability of nanocomposites was seen [12]. There are several inorganic fillers reported in literature that when added to polymers enhanced their electrical, mechanical, and thermal properties.…”