1973
DOI: 10.1016/0038-1101(73)90046-4
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Thermal effects on the forward characteristics of silicon p-i-n diodes at high pulse currents

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Cited by 31 publications
(10 citation statements)
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“…Therefore, the SiC pn diode could be shown to have superior heat resistance to Si pn diode. From [10][11] [12], the cause of the diode destruction for a surge current was reported as follows.…”
Section: Results Of Measurementsmentioning
confidence: 99%
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“…Therefore, the SiC pn diode could be shown to have superior heat resistance to Si pn diode. From [10][11] [12], the cause of the diode destruction for a surge current was reported as follows.…”
Section: Results Of Measurementsmentioning
confidence: 99%
“…Fig. 11 shows the temperature dependences of the resistances obtained from the I-V characteristics of Si pn diode in the reference [10]. The negative temperature coefficient resistance behavior appeared at the junction temperature of over 430 O C during the destruction of the Si pn diode.…”
Section: Results Of Measurementsmentioning
confidence: 99%
“…During a surge event, the junction temperatures inside the semiconductor devices can reach extremely high values, possibly several times the maximum rated temperature. It was reported that the main failure mechanism for standard silicon diode and transistor chips within module housings, is the melting of the anode-side metallization [32,33,34].…”
Section: Discussionmentioning
confidence: 99%
“…The uppermost curves are current data. model of Choo (1,(8)(9)(10) for a current density of 50 ,000A/cns 2 give ~A a 1018 for the average steadyNotice in Fig. 9, the shift of current denstate base carrier concentration .…”
Section: Fi G 1 -Bloc K Diagram Of the Experimenta L Systemmentioning
confidence: 99%
“…This is threaded into a device mounting pedestal (1) up on which the test device (13) is mounted . The concentric pulse forming networks are connected to flange ( 12), and cover plate ( 8 ).…”
Section: 3mentioning
confidence: 99%